Skip to main content
SpringerLink
Log in

The residual strain measurement of thin conductive metal wire after electrical failure with SEM moiré

  • Published:
Acta Mechanica Solida Sinica Aims and scope Submit manuscript

Abstract

In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moiré. Focused ion beam (FIB) milling is applied to fabricate micron moiré gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moiré fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moiré method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Wang, Q.H., Xie, H.M., Feng, X., Chen, Z. and Dai, F.L., Delamination and electromigration of film lines on polymer substrate under electrical loading. Electron Device Letters, IEEE, 2009, 30: 11–13.

    Article  Google Scholar 

  2. Post, D., Moire interferometry for engineering and science. In: Eighth International Symposium on Laser Metrology, 2005: 29–43.

  3. Zhong, Z.W. and Nah, S.K., Thermal strain analysis of an electronics package using the SEM Moire technique. Soldering & Surface Mount Technology, 2003, 15: 33–35.

    Article  Google Scholar 

  4. Kishimoto, S., Tanaka, Y., Yin, F., Kagawa, Y. and Nagai, K., Strain distribution measurement in laminated martensitic/austenitic steel during a compressive test by the electron moire method. The Journal of Strain Analysis for Engineering Design, 2011, 46: 1–6.

    Article  Google Scholar 

  5. Tang, M.J., Xie, H.M., Wang, Q.H. and Zhu, J.G., Phase-shifting laser scanning confocal microscopy moire method and its applications. Meas Sci Technol, 2010, 21: 055110.

    Article  Google Scholar 

  6. Zhang, N. and Tong, W., An experimental study on grain deformation and interactions in an Al-0.5% Mg multicrystal. Int. J. Plast., 2004, 20: 523–542.

    Article  Google Scholar 

  7. Carroll, J., Abuzaid, W., Lambros, J. and Sehitoglu, H., An experimental methodology to relate local strain to microstructural texture. Rev Sci Instrum, 2010, 81: 083703.

    Article  Google Scholar 

  8. Kang, Y.L., Zhang, Z.F., Wang, H.W. and Qin, Q.H., Experimental investigations of the effect of thickness on fracture toughness of metallic foils. Materials Science and Engineering: A, 2005, 394: 312–319.

    Article  Google Scholar 

  9. Chen, J.L., Zhang, X.C. and Zhan, N., Extended digital image correlation method for micro-region deformation measurement. Sci China Technol Sc, 2011, 54: 1–7.

    MATH  Google Scholar 

  10. Qian, K.M., Wang, H.X. and Gao, W.J., Windowed Fourier transform for fringe pattern analysis: theoretical analyses. Appl Optics, 2008, 47: 5408–5419.

    Article  Google Scholar 

  11. Wang, Z. and Han, B., Advanced iterative algorithm for phase extraction of randomly phase-shifted inter-ferograms. Opt Lett, 2004, 29: 1671–1673.

    Article  Google Scholar 

  12. Wang, Z. and Han, B., Advanced iterative algorithm for randomly phase-shifted interferograms with intra-and inter-frame intensity variations. Opt Laser Eng, 2007, 45: 274–280.

    Article  Google Scholar 

  13. Xiao, X., Kang, Y., Hou, Z., Qiu, W. and Li, X., Displacement and strain measurement by circular and radial gratings Moiré method. Exp Mech, 2010, 50: 239–244.

    Article  Google Scholar 

  14. Xiao, X., Song, H.P., Kang, Y.L., Li, X.L., Tan, X.H. and Tan, H.Y., Experimental analysis of crack tip fields in rubber materials under large deformation. Acta Mech Sinica, 2012, 28: 432–437.

    Article  Google Scholar 

  15. Sutton, M.A., Chen, M.Q., Peters, W.H., Chao, Y.J. and McNeill, S.R., Application of an optimized digital correlation method to planar deformation analysis. Image Vision Comput, 1986, 4: 143–150.

    Article  Google Scholar 

  16. Pan, B., Wang, Z. and Lu, Z., Genuine full-field deformation measurement of an object with complex shape using reliability-guided digital image correlation. Opt Express, 2010, 18: 1011–1023.

    Article  Google Scholar 

  17. Roux-Langlois, C., Gravouil, A., Baietto, M.C., Réthoré, J., Mathieu, F., Hild, F. and Roux, S., DIC identification and X-FEM simulation of fatigue crack growth based on the Williams’ series. International Journal of Solids & Structures, 2015, 53: 38–47.

    Article  Google Scholar 

  18. Wang, Q.H., Hu, Z.X., Zhang, J., Sun, J. and Liu, G., Residual thermo-creep deformation of copper interconnects by phase shifting SEM Moiré method. Applied Mechanics and Materials, 2011, 83: 185–190.

    Article  Google Scholar 

  19. Xie, H.M., Kishimoto, S., Li, Y.J., Liu, Q.J. and Zhao, Y.P., Fabrication of micro-moire gratings on a strain sensor structure for deformation analysis with micro-moire technique. Microelectron Reliab, 2009, 49: 727–733.

    Article  Google Scholar 

  20. Kishimoto, S., Shinya, N. and Mathew, M., Application of electron beam lithography to study microcreep deformation and grain boundary sliding. J Mater Sci, 1997, 32: 3411–3417.

    Article  Google Scholar 

  21. Xing, Y.M., Tanaka, Y., Kishimoto, S. and Shinya, N., Determining interfacial thermal residual stress in SiC/Ti-15-3 composites. Scripta Mater, 2003, 48: 701–706.

    Article  Google Scholar 

  22. Lee, O. and Read, D. Micro-strain distribution around a crack tip by electron beam moire methods. Journal of Mechanical Science and Technology, 1995, 9: 298–311.

    Google Scholar 

  23. Post, D., McKelvie, J., Tu, M. and Dai, F., Fabrication of holographic gratings using a moving point source. Appl Optics, 1989, 28: 3494–3497.

    Article  Google Scholar 

  24. Moulart, R., Rotinat, R., Pierron, F. and Lerondel, G., On the realization of microscopic grids for local strain measurement by direct interferometric photolithography. Opt. Laser Eng., 2007, 45: 1131–1147.

    Article  Google Scholar 

  25. Xie, H.M., Li, Y.J., Du, H., Pan, B., Luo, Q., Gu, C.Z. and Jiang, H.C., The technique for fabricating submicron moiré grating using FIB milling. Advanced Materials Research, 2008, 47: 710–713.

    Article  Google Scholar 

  26. Li, Y.J., Xie, H.M., Guo, B.Q., Luo, Q., Gu, C.Z. and Xu, M.Q., Fabrication of high-frequency moiré gratings for microscopic deformation measurement using focused ion beam milling. J. Micromech. Microeng., 2010, 20: 055037.

    Article  Google Scholar 

  27. Tang, M.J., Xie, H.M., Zhu, J.G., Li, X.J. and Li, Y.J., The study of moiré grating fabrication on metal samples using nanoimprint lithography. Opt Express, 2012, 20: 2942–2955.

    Article  Google Scholar 

  28. Durelli, A. and Parks, V. Moiré Analysis of Strain. Prentice-Hall Englewood Cliffs, NJ, 1970.

    Google Scholar 

  29. Wang, Z.Y., Development and application of computer-aided fringe analysis. Mechanical Engineering, University of Maryland, 2003: 53–66.

  30. Chiang, F.P., Moiré methods of strain analysis. Exp. Mech., 1979, 19: 290–308.

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. AML, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China

    Yanjie Li, Huimin Xie, Mengmeng Zhou & Manqiong Xu

  2. School of Civil Engineering and Architecture, University of Jinan, 250022, Jinan, China

    Yanjie Li

  3. National Institute of Advanced Industrial Science and Technology, 1-1-1 Umezono, 305-8568, Ibaraki, Tsukuba, Japan

    Qinghua Wang

  4. Institute of Physics, Chinese Academy of Sciences, 100190, Beijing, China

    Qiang Luo & Changzhi Gu

Authors
  1. Yanjie Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Huimin Xie
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Qinghua Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Mengmeng Zhou
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Manqiong Xu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Qiang Luo
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Changzhi Gu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Huimin Xie.

Additional information

Project supported by the National Natural Science Foundation of China (Nos. 11232008, 11227801 and 11302082) and the Doctoral Program of University of Jinan (No. XBS1307).

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, Y., Xie, H., Wang, Q. et al. The residual strain measurement of thin conductive metal wire after electrical failure with SEM moiré. Acta Mech. Solida Sin. 29, 371–378 (2016). https://doi.org/10.1016/S0894-9166(16)30240-3

Download citation

  • Received:

  • Revised:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1016/S0894-9166(16)30240-3

Key Words

Search

Navigation