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Effect of Deposition Technique of SiNx Passivation Layer on the Electrical DC and RF Properties of AlGaN/GaN HEMTs

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Abstract

In this paper, we present the results of a comparative analysis of two alternative SiNx passivation techniques of AlGaN/GaN high electron mobility transistor (HEMT) manufactured using identical epitaxial structure and fabrication processes. AlGaN/GaN HEMT has demonstrated excellent device characteristics, making them excellent candidates for high power, high frequency, and low noise applications. However, the full potential of GaN HEMTs in large signal operation at high frequency is limited by trapping effects and leakage currents at the interface between the epitaxial structure and passivation layer. A SiNx passivation layer has commonly been used to prevent electron trapping at the surface by providing extra positive charges to neutralize trapped negative electrons on the surface. This comparative study investigates the effects of a 75 nm SiNx passivation layer fabricated using both plasma-enhanced chemical vapor deposition (PECVD) and inductively coupled plasma chemical vapor deposition (ICPCVD) techniques on the DC and RF performance of the transistor.

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References

  1. R.S. Pengelly, S.M. Wood, J.W. Milligan, S.T. Sheppard, W.L. Pribble, A review of gan on SIC high electron-mobility power transistors and mmics. IEEE Trans. Microw. Theory Tech. 60(6), 1764–1783 (2012). https://doi.org/10.1109/tmtt.2012.2187535

    Article  CAS  Google Scholar 

  2. S.B. Lisesivdin, S. Demirezen, M.D. Caliskan, A. Yildiz, M. Kasap, S. Ozcelik, E. Ozbay, Growth parameter investigation of AL0.25Ga0.75n/Gan/ALN heterostructures with Hall effect measurements. Semicond. Sci. Technol. 23(9), 095008 (2008). https://doi.org/10.1088/0268-1242/23/9/095008

    Article  CAS  Google Scholar 

  3. S.B. Lisesivdin, A. Yildiz, S. Acar, M. Kasap, S. Ozcelik, E. Ozbay, Electronic Transport Characterization of algan∕gan heterostructures using quantitative mobility spectrum analysis. Appl. Phys. Lett. (2007). https://doi.org/10.1063/1.2778453

    Article  Google Scholar 

  4. U.K. Mishra, P. Parikh, Y.F. Wu, Algan/Gan HEMTs-an overview of device operation and applications. Proc. IEEE 90(6), 1022–1031 (2002). https://doi.org/10.1109/jproc.2002.1021567

    Article  CAS  Google Scholar 

  5. H. Lu, B. Hou, L. Yang, M. Zhang, L. Deng, M. Wu, Z. Si, S. Huang, X. Ma, Y. Hao, High RF performance gan-on-si hemts with passivation implanted termination. IEEE Electron Device Lett. 43(2), 188–191 (2022). https://doi.org/10.1109/led.2021.3135703

    Article  CAS  Google Scholar 

  6. S. Nakajima, Gan HEMTs for 5G base station applications. IEEE Int. Electron Devices Meet (IEDM) (2018). https://doi.org/10.1109/iedm.2018.8614588

    Article  Google Scholar 

  7. R. Sun, J. Lai, W. Chen, B. Zhang, Gan power integration for high frequency and high efficiency power applications: a review. IEEE Access 8, 15529–15542 (2020). https://doi.org/10.1109/access.2020.2967027

    Article  Google Scholar 

  8. W.S. Tan, P.A. Houston, P.J. Parbrook, G. Hill, R.J. Airey, Comparison of different surface passivation dielectrics in Algan/Gan heterostructure field-effect transistors. J. Phys. D Appl. Phys. 35(7), 595–598 (2002). https://doi.org/10.1088/0022-3727/35/7/304

    Article  CAS  Google Scholar 

  9. X.Z. Dang, E.T. Yu, E.J. Piner, B.T. McDermott, Influence of surface processing and passivation on carrier concentrations and transport properties in Algan/Gan Heterostructures. J. Appl. Phys. 90(3), 1357–1361 (2001). https://doi.org/10.1063/1.1383014

    Article  CAS  Google Scholar 

  10. I. Harrison, N.W. Clayton, N.J. Jeffs, High temperature RF characterisation of sin passivated and unpassivated Algan/Gan HFETs. Phys. Stat. Solidi (a) 188(1), 275–278 (2001). https://doi.org/10.1002/1521-396x(200111)188:1%3c275::aid-pssa275%3e3.0.co;2-d

    Article  CAS  Google Scholar 

  11. W. Lu, V. Kumar, R. Schwindt, E. Piner, I. Adesida, A comparative study of surface passivation on Algan/Gan HEMTs. Solid-State Electron. 46(9), 1441–1444 (2002). https://doi.org/10.1016/s0038-1101(02)00089-8

    Article  CAS  Google Scholar 

  12. T. Hashizume, S. Ootomo, S. Oyama, M. Konishi, H. Hasegawa, Chemistry and electrical properties of surfaces of gan and Gan/Algan heterostructures. J. Vac. Sci. Technol. B: Microelectron. Nanometer Struct 19(4), 1675 (2001). https://doi.org/10.1116/1.1383078

    Article  CAS  Google Scholar 

  13. B. Luo, R. Mehandru, J. Kim, F. Ren, B.P. Gila, A.H. Onstine, C.R. Abernathy, S.J. Pearton, R. Fitch, J. Gillespie, T. Jenkins, J. Sewell, D. Via, A. Crespo, Y. Irokawa, Comparison of surface passivation films for reduction of current collapse in algan/gan high electron mobility transistors. J. Electrochem. Soc. (2002). https://doi.org/10.1149/1.1512675

    Article  Google Scholar 

  14. J. Madan, R. Pandey, H. Arora, R. Chaujar. (2018). Analysis of varied dielectrics as surface passivation on Algan/GAN HEMT for analog applications. In: 2018 6th Edition of International Conference on Wireless Networks & Embedded Systems (WECON). https://doi.org/10.1109/wecon.2018.8782074

  15. K.S. Kim, K.H. Kim, Y.J. Ji, J.W. Park, J.H. Shin, A.R. Ellingboe, G.Y. Yeom, Silicon nitride deposition for flexible organic electronic devices by VHF (162 mhz)-pecvd using a multi-tile push-pull plasma source. Sci. Rep. (2017). https://doi.org/10.1038/s41598-017-14122-4

    Article  PubMed  PubMed Central  Google Scholar 

  16. M. Maeda, T. Watanabe, Evaluation of photocatalytic properties of titanium oxide films prepared by plasma-enhanced chemical vapor deposition. Thin Solid Films 489(1–2), 320–324 (2005). https://doi.org/10.1016/j.tsf.2005.05.007

    Article  CAS  Google Scholar 

  17. G. Dutta, N. DasGupta, A. DasGupta, Low-temperature ICP-CVD SiNx as gate dielectric for gan-based MIS-HEMTs. IEEE Trans. Electron Devices 63(12), 4693–4701 (2016). https://doi.org/10.1109/ted.2016.2618421

    Article  CAS  Google Scholar 

  18. M.-J. Kang, H.-S. Kim, H.-Y. Cha, K.-S. Seo, Development of catalytic-CVD SINX passivation process for Algan/Gan-on-Si HEMTs. Crystals 10(9), 842 (2020). https://doi.org/10.3390/cryst10090842

    Article  CAS  Google Scholar 

  19. K.N. Subhani, N.S.N. Remesh, S.R.M. Raghavan, D.N. Nath, K.N. Bhat, Nitrogen Rich Pecvd silicon nitride for passivation of si and algan/gan HEMT devices. Solid-State Electron. 186, 108188 (2021). https://doi.org/10.1016/j.sse.2021.108188

    Article  CAS  Google Scholar 

  20. R. Aubry, J.C. Jacquet, M. Oualli, O. Patard, S. Piotrowicz, E. Chartier, N. Michel, L. Trinh Xuan, D. Lancereau, C. Potier, M. Magis, P. Gamarra, C. Lacam, M. Tordjman, O. Jardel, C. Dua, S.L. Delage, ICP-CVD sin passivation for high-power RF inalgan/gan/SIC HEMT. IEEE Electron Device Lett. 37(5), 629–632 (2016). https://doi.org/10.1109/led.2016.2540164

    Article  CAS  Google Scholar 

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Acknowledgements

Some part of that study is presented as an abstract at 9th International Conference on Materials Science and Nanotechnology for Next Generation (MSNG-2022).

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Correspondence to Yağmur Güler.

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Güler, Y., Onaylı, B., Haliloğlu, M.T. et al. Effect of Deposition Technique of SiNx Passivation Layer on the Electrical DC and RF Properties of AlGaN/GaN HEMTs. Trans. Electr. Electron. Mater. 25, 180–186 (2024). https://doi.org/10.1007/s42341-023-00492-2

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