Abstract
We fabricated a 0.18-μm gate-length AlGaN/GaN high electron mobility transistor (HEMT) on SiC substrate fabricated by using two-step gate recessing which was composed of inductively coupled plasma (ICP) dry etching with a gas mixture of BCl3/Cl2 and wet chemical etching using the oxygen plasma treatment and HCl-based cleaning. The two-step gate recessing process exhibited an etch depth of 4.5 nm for the AlGaN layer and the clean surface of AlGaN layer at the AlGaN/gate metal contact region for the AlGaN/GaN HEMT structure. The recessed 0.18 μm × 200 μm AlGaN/GaN HEMT devices showed good DC characteristics, having a good Schottky diode ideality factor of 1.25, an extrinsic transconductance (g m ) of 345 mS/mm, and a threshold voltage (V th ) of −2.03 V. The recessed HEMT devices exhibited high RF performance, having a cut-off frequency (f T ) of 48 GHz and a maximum oscillation frequency (f max ) of 130 GHz. These devices also showed minimum noise figure of 0.83 dB and associated gain of 12.2 dB at 10 GHz.
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Yoon, H.S., Min, BG., Lee, J.M. et al. Characterization of 0.18-μm gate length AlGaN/GaN HEMTs on SiC fabricated using two-step gate recessing. Journal of the Korean Physical Society 71, 360–364 (2017). https://doi.org/10.3938/jkps.71.360
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DOI: https://doi.org/10.3938/jkps.71.360