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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

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Abstract

Cu/In-48Sn-xCuZnAl/Cu (x = 0, 0.1, 0.2, 0.4, 0.6 wt.%) solder joints were prepared by transient liquid phase (TLP) bonding. The microstructure and shear property of the Cu/In-48Sn-xCuZnAl/Cu composite solder joints were investigated. The results show that there were γ-InSn4 phase and β-In3Sn phase in the composite solder joints, and Cu2(In,Sn) phase was obtained in the Cu/In-48Sn-0.6CuZnAl/Cu composite solder joint. CuZnAl particles can refine the microstructure of solder joints, and the average size of the γ-InSn4 phase decreased from 18.3 µm in the Cu/In-48Sn/Cu solder joint to 10.5 µm in the Cu/In-48Sn-0.2CuZnAl/Cu composite solder joint. The thickness of the interfacial intermetallic compound (IMC) layer was decreased with increasing content of CuZnAl particles, and the minimum thickness of the interfacial IMC layer of about 8.1 µm was obtained by the Cu/In-48Sn-0.6CuZnAl/Cu composite solder joint. The shear strength of the Cu/In-48Sn/Cu solder joint is approximately 8.6 MPa, and the maximum shear strength of 16.8 MPa was obtained by adding 0.2 wt.% CuZnAl particle. The fracture of the Cu/In-48Sn-xCuZnAl/Cu solder joints is located in the in situ reaction zone. The failure mode of the Cu/In-48Sn/Cu solder joints is ductile-brittle mixed fracture, and the failure mode of composite solder joints changes to ductile fracture after adding CuZnAl particles.

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The authors confirm that the data supporting the findings of this study are available within the article.

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Funding

This research was financially supported by the National Natural Science Foundation of China (52165068) and the Guangxi Natural Science Foundation Project (2020GXNSFAA297004).

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Authors and Affiliations

  1. School of Advanced Manufacturing, Guangdong University of Technology, Jieyang, 510006, China

    Li Yang

  2. School of Mechanical Engineering, Guilin University of Aerospace Technology, Guilin, 541004, China

    Li Yang

  3. School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China

    Haodong Wu & Qiusheng Lin

  4. School of Automotive Engineering, Changshu Institute of Technology, Changshu, 215500, China

    Yaocheng Zhang

  5. School of Mechanical Engineering, Soochow University, Suzhou, 215021, China

    Kaijian Lu

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  1. Li Yang
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Correspondence to Li Yang or Yaocheng Zhang.

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Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Yang, L., Wu, H., Zhang, Y. et al. Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding. Weld World 68, 61–69 (2024). https://doi.org/10.1007/s40194-023-01621-4

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  • DOI: https://doi.org/10.1007/s40194-023-01621-4

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