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Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

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Abstract

The work is devoted to the study of direct soldering of a substrate of Al2O3 ceramics with a Cu substrate by use of Bi11Ag2La solder. Soldering was realised by fluxless method in air by activation with power ultrasound. It was found out that lanthanum is during the ultrasonic soldering process distributed to the interface with Al2O3 substrate, enhancing thus the bond formation. The bond with ceramic substrate has adhesive character without formation of a new contact interlayer. The shear strength of joint with Al2O3 ceramics is 20 MPa.

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Acknowledgments

The authors thank Ing. Marián Drienovský, PhD. for DSC analysis, Ing. Martin Sahul, PhD. for EDX analysis, RNDr. Petr Harcuba for microscopic analysis and then to Prof. Ing. Maroš Martinkovič, PhD. for providing the methodics for shear test measurement.

Funding

The contribution was prepared with the support of APVV–0023–12 project: Research of new soldering alloys for fluxless soldering with application of beam technologies and ultrasound and VEGA 1/0089/17 project: Research of new alloys for direct soldering of metallic and ceramic materials.

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Authors and Affiliations

  1. Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Paulínska 16, 917 24, Trnava, Slovak Republic

    Roman Koleňák & Erika Hodúlová

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  1. Roman Koleňák
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  2. Erika Hodúlová
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Corresponding author

Correspondence to Roman Koleňák.

Additional information

Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Koleňák, R., Hodúlová, E. Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder. Weld World 62, 415–426 (2018). https://doi.org/10.1007/s40194-017-0538-6

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  • DOI: https://doi.org/10.1007/s40194-017-0538-6

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