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Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders

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Abstract

Ceramic-metal composite components manufactured by brazing/soldering technology have broad application in industry due to their excellent properties. The present study investigated soldering of Al2O3 ceramic with Al2O3 ceramic, copper, and 5056 aluminum alloy respectively by using a new type Sn-Zn-Sb solder at 250 °C in air with the assistance of ultrasonic. Microstructure of the Sn-9Zn-xSb solders with various content of Sb was analyzed. And the effect of Sb content on ceramic/ceramic joint strength was studied. The microstructures of solder/substrate interfaces and the bonding mechanism were emphatically studied. A significantly new intermetallic phase, Zn4Sb3 is detected in the microstructure of solder while the content of Zn4Sb3 and β-Sn phases increased with the content of Sb element. During the soldering process, Sn-Zn-Sb solder was composed of liquid Sn-Zn alloy and solid ZnSb intermetallic phase, and the quasi-melting state of the solder was found to be the decisive factor in achieving reliable ceramic/solder bonds. There was no reaction layer at ceramic/solder interface, and the solder filled grooves on the ceramic surface to form a firm mechanical bonding, thus results in higher strength. Fractures occurred on the ceramic/solder interface and Zn4Sb3 particles were found embedded in ceramic side.

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Funding

The authors wish to thank the financial support from the Ministry of Science and Technology of the People’s Republic of China, under the key special projects of the national key R&D program 2017YFB0305700.

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Authors and Affiliations

  1. School of Mechanical Engineering & Automation, Beihang University, Xueyuan Road 37, Haidian District, Beijing, 100191, China

    Yongchao Wu, Wenqing Qu, Jie Zhang & Hongshou Zhuang

  2. College of Materials Science and Engineering, Beijing University of Technology, Pingleyuan 100, Chaoyang District, Beijing, 100124, China

    Hong Li

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  1. Yongchao Wu
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  2. Hong Li
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Correspondence to Hong Li.

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Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Wu, Y., Li, H., Qu, W. et al. Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders. Weld World 64, 247–256 (2020). https://doi.org/10.1007/s40194-019-00815-z

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  • DOI: https://doi.org/10.1007/s40194-019-00815-z

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