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Shape memory alloy actuation of non-bonded piezo sensor configuration for bone diagnosis and impedance based analysis

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Abstract

In the recent years, there has been a growing interest in research community towards the application of smart materials for bio-medical structural health monitoring. Amongst the smart materials, directly bonded piezo sensors (DBPS), based on the electro-mechanical impedance (EMI) technique, have been successfully employed for the above purpose. The principle behind the EMI technique is that high frequency excitations (typically > 30 kHz) generated by a surface bonded PZT patch are used to detect changes in structural drive point impedance caused by cracks or any other type of damage. Bone healing and damage have been shown to be successfully monitored using the DBPS. However, in most of the diagnostic cases of live human and animal subjects, directly bonding a PZT patch is always an irritant or hazard for a live subject. To circumvent direct bonding, the authors have developed and experimentally demonstrated a non-bonded piezo sensor (NBPS) configuration as a good alternative to DBPS while maintaining the effectiveness of measurement well within discernible limits. This paper presents further improvement in the NBPS configuration aiming at autonomous operation of the gripping mechanism using shape memory alloy (SMA) wires. The experiments are performed on replicas of femur bone in healthy and osteoporosis state. This paper shows the effective use of SMA clamping for bone identification and its damage assessment in comparison to earlier mechanical gripping using jubilee clamps. This paper also covers impedance based identification applied to SMA and clamp based NBPS configurations. In place of raw admittance signatures, effective drive point impedance is utilized for the purpose of bone diagnostics which provides a more realistic assessment of the condition of bone.

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Authors and Affiliations

  1. School of Engineering and Technology, Indira Gandhi National Open University, Maidan Garhi, New Delhi, 110068, India

    Shashank Srivastava

  2. Department of Civil Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi, 110016, India

    Suresh Bhalla & Alok Madan

Authors
  1. Shashank Srivastava
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  2. Suresh Bhalla
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  3. Alok Madan
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Correspondence to Suresh Bhalla.

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Shashank Srivastava: Formerly Research Scholar, Indian Institute of Technology, New Delhi.

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Srivastava, S., Bhalla, S. & Madan, A. Shape memory alloy actuation of non-bonded piezo sensor configuration for bone diagnosis and impedance based analysis. Biomed. Eng. Lett. 9, 435–447 (2019). https://doi.org/10.1007/s13534-019-00128-6

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  • DOI: https://doi.org/10.1007/s13534-019-00128-6

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