Skip to main content
SpringerLink
Log in

Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions

  • Original Article - Chemistry and Biomaterials
  • Published:
Electronic Materials Letters Aims and scope Submit manuscript

Abstract

Efficient diffusion barriers are necessary to prevent the formation of copper-tin intermetallic compounds (IMCs) in advanced packaging for Sn/Cu micro-bumps. This study investigated the interfacial properties of solder and Ni, Co-9W, Co-20W, Co-20Fe-10W, and Co-36Fe-17W barriers and determined the thickness of IMCs formed between Sn and these barriers after up to 15 reflows. Among the five barriers, Co-36Fe-17W proved to be the most effective in inhibiting the reaction of liquid Sn solder. At the Sn/Co-W interface, CoSn3 IMC was formed, while at the Sn/Co-Fe-W interface, CoSn3 IMC and FeSn2 IMC were observed. The contact angles of these layers were measured and found to be 18°, 22°, 25°, 29°, and 27°, respectively. The results showed that an increase in W content in Co-W led to an increase in the contact angle, while the intrinsic wettability of Co-Fe-W decreased with an increase in Fe content. The shear strengths of the five joints were 27 MPa, 31 MPa, 25 MPa, 25 MPa, and 26 MPa, respectively, with different fracture modes observed. The Co-Fe-W-Sn layer was partially peeling from the diffusion barriers in SAC305/Co-20Fe-10W, and the fracture surfaces exhibited an irregular and rough state, which was attributed to the increasing Fe and W contents. These findings offer valuable insights for enhancing the reliability of electronic packages.

Graphical Abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5

Similar content being viewed by others

References

  1. Sun, L., Chen, M., Zhang, L., He, P., Xie, L.: Recent progress in SLID bonding in novel 3D-IC technologies. J. Alloys Compd. 818, 152825 (2020)

    Article  CAS  Google Scholar 

  2. Lau, J.H.: Recent advances and trends in advanced packaging. IEEE Trans. Compon. Packaging Manuf. Technol. 12, 228–252 (2022)

    Article  Google Scholar 

  3. Lim, G.T., Kim, B.J., Lee, K., et al.: Temperature effect on intermetallic compound growth kinetics of Cu pillar/Sn bumps. J. Electron. Mater. 38, 2228–2233 (2009)

    Article  CAS  Google Scholar 

  4. Liashenko, O.Y., Lay, S., Hodaj, F.: On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface. Acta Mater. 117, 216–227 (2016)

    Article  CAS  Google Scholar 

  5. Hu, X., Li, Y., Liu, Y., et al.: Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging[J]. Microelectron. Reliab. 54(8), 1575–1582 (2014)

    Article  Google Scholar 

  6. Borgesen, P., Yin, L., Kondos, P.: Assessing the risk of Kirkendall voiding in Cu3Sn. Microelectron. Reliab. 51(4), 837–846 (2011)

    Article  CAS  Google Scholar 

  7. Kannojia, H.K., Dixit, P.: A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn layers for microsystems packaging[J]. J. Mater. Sci. Mater. Electron. 32, 6742–6777 (2021)

    Article  CAS  Google Scholar 

  8. Liu, Y.X., Chu, Y.C., Tu, K.N.: Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 µm diameter. Acta Mater. 117, 146–152 (2016)

    Article  CAS  Google Scholar 

  9. Shen, J., Chan, Y.C., Liu, S.Y.: Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction. Acta Mater. 57, 5196–5206 (2009)

    Article  CAS  Google Scholar 

  10. Ghosh, G.: Thermodynamic modeling of the nickel-lead-tin system. Metall. Mater. Trans. A. 30, 1481–1494 (1999)

    Article  Google Scholar 

  11. Chen, K., Ling, H., Guo, F., et al.: Effect of Ni barrier layer thickness on IMCs evolution in Ф5µm Cu/Ni/Sn pillar bumps. 19th International Conference on Electronic Packaging Technology (ICEPT 2018), 190–194 (2018)

  12. Chen, C.M., Chen, S.W.: Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures. Acta Mater. 50, 2461–2469 (2002)

    Article  CAS  Google Scholar 

  13. Chen, S., Tan, L., Yang, C., et al.: Effects of amorphous CoW and NiW barrier layers on the evolution of Sn/Cu interface. Mater. Charact. 181, 111448 (2021)

    Article  CAS  Google Scholar 

  14. Chen, S., Yang, C., Tan, L., et al.: Effects of W contents on the solid-state interfacial reactions of Sn/Co-W. J. Mater. Sci. 1–13. (2022)

  15. Liu, Y., Chen, P., Yan, P., et al.: Diffusion barrier property of Co-W layer compared with ni layer in fine pitch micro-bumps during high temperature storage. Mater. Lett. 347, 134572 (2023)

    Article  CAS  Google Scholar 

  16. Liu, Y., Li, C., Chen, P., et al.: Effects of Electrodeposited Co–W and Co–Fe–W diffusion barrier layers on the evolution of Sn/Cu interface. Mater. Chem. Phys. 128761. (2023)

  17. Derakhshandeh, J., Beyne, E., Beyer, G., et al.: Low temperature backside damascene processing on temporary carrier wafer targeting 7µm and 5µm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE. 1108–1113

  18. Kyaw, T.T., Tunthawiroon, P., Kanlayasiri, K., et al.: A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages. Intermetallics, 125. (2020)

  19. Chen, L., Chen, S., Chen, P., et al.: Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure. Mater. Lett. 331, 133501 (2023)

    Article  CAS  Google Scholar 

  20. Pan, H.C., Hsieh, T.E.: Diffusion barrier characteristics of electroless Co(W,P) thin films to lead-free SnAgCu solder. J. Electrochem. Soc., 158(11). (2011)

  21. Chew, C.S., Durairaj, R., Haseeb A S M A, et al.: Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation. Soldering Surf. Mt. Technol. 27(2), 90–94 (2015)

    Article  Google Scholar 

  22. Pal, M.K., Gergely, G., Gácsi, Z.: Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition. J. Mater. Res. Technol. 24, 8320–8331 (2023)

    Article  CAS  Google Scholar 

  23. Pal, M.K., Gergely, G., Koncz-Horváth, D., et al.: Investigation of the electroless nickel plated sic particles in sac305 solder matrix. Powder Metall. Met. Ceram. 58(9–10), 529–537 (2020)

    Article  CAS  Google Scholar 

  24. Pal, M.K., Gergely, G., Koncz-Horváth, D., et al.: Distribution and microstructure analysis of ceramic particles in the lead‐free solder matrix[J]. Cryst. Res. Technol. 55(12), 2000123 (2020)

    Article  CAS  Google Scholar 

  25. Pal, M.K., Gergely, G., Koncz-Horváth, D., et al.: Investigation of microstructure and wetting behavior of Sn–3.0 Ag–0.5 cu (SAC305) lead-free solder with additions of 1.0 wt% SiC on copper substrate. Intermetallics. 128, 106991 (2021)

    Article  CAS  Google Scholar 

  26. Görlich, J., Baither, D., Schmitz, G.: Reaction kinetics of Ni/Sn soldering reaction. Acta Mater. 58(9), 3187–3197 (2010)

    Article  Google Scholar 

  27. Tian, S., Zhou, J., Xue, F., et al.: Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. J. Mater. Sci.: Mater. Electron. 29, 16388–16400 (2018)

    CAS  Google Scholar 

  28. Wang, C., Kuo, C., Huang, S., et al.: Temperature effects on liquid-state Sn/Co interfacial reactions. Intermetallics. 32, 57–63 (2013)

    Article  Google Scholar 

  29. Fick, A.V.: On liquid diffusion. Lond. Edinb. Dublin Philosophical Magazine J. Sci. 10(63), 30–39 (1855)

    Article  Google Scholar 

  30. Amore, S., Ricci, E., Borzone, G., et al.: Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates. Mater. Sci. Eng. A. 495(1–2), 108–112 (2008)

    Article  Google Scholar 

  31. Willis, B.: Reflow soldering processes and troubleshooting SMT, BGA, CSP and Flip Chip technologies, vol. 15. Soldering & Surface Mount Technology (2003). 1

  32. Lu, M.H., Lauro, P., Goldsmith, C.: Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer. Proc. Asme Pac. Rim Tech. Conf. Exhib. Packaging Integr. Electron. Photonic Syst. Mems Nems 2011. 1, 453 (2012)

    Google Scholar 

  33. Chen, H., Tsai, Y.L., Chang, Y.T., et al.: Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on co-based surface finishes. J. Alloys Compd. 671, 100–108 (2016)

    Article  CAS  Google Scholar 

  34. Gao, L.Y., Luo, Y.X., Wan, P., et al.: Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints. Mater. Charact. 178. (2021)

  35. Hu, X., Xu, T., Keer, L.M., et al.: Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints. Mater. Sci. Eng. A. 673, 167–177 (2016)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This research received funding from the National Natural Science Foundation of China (61176097). The authors express their gratitude to the Instrumental Analysis Center of Shanghai Jiao Tong University for providing access to a range of characterization equipment.

Author information

Authors and Affiliations

  1. State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, People’s Republic of China

    Yuexiao Liu, Chongyang Li, Peixin Chen, Jinyang Liu, Anmin Hu & Ming Li

Authors
  1. Yuexiao Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Chongyang Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Peixin Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Jinyang Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Anmin Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Ming Li
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

Yuexiao Liu: Methodologies, Writing – original draft, Formal analysis, Investigation, Visualization. Chongyang Li:Writing – review & editing. Peixin Chen: review & editing. Jinyang Liu: review & editing. Anmin Hu: Conceptualization, Supervision. Ming Li: Project administration.

Corresponding author

Correspondence to Anmin Hu.

Ethics declarations

Conflict of Interest

The authors state that they have no competing financial interests or personal relationships that could have influenced the work reported in this paper.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Electronic Supplementary Material

Below is the link to the electronic supplementary material.

Supplementary Material 1

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Liu, Y., Li, C., Chen, P. et al. Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions. Electron. Mater. Lett. (2024). https://doi.org/10.1007/s13391-024-00491-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s13391-024-00491-2

Keywords

Search

Navigation