Abstract
The effect of two strategic approaches, such as modification of active layer geometry and control of active channel composition, were investigated to improve the on/off ratio (ION/IOFF) and field-effect mobility (µFE) of mesa-shaped nanoscale vertical-channel thin-film-transistor (VTFT). The SiO2 spacer was deposited by using plasma-enhanced chemical vapor deposition and patterned via plasma etching process with Ar/CF4 gas mixtures to form a vertical sidewall, corresponding to a channel length of 170 nm. The gate-stack structures including an In–Ga–Zn–O (IGZO) active layer were deposited by atomic layer deposition with a complete conformality along the spacer sidewall. The ION/IOFF of the IGZO VTFT was significantly enhanced from 6.7 × 103 to 2.1 × 109 by lowering the off-state current when the layout geometry of active layer was properly designed to eliminate the uncontrolled current path between the vertically separated source and drain (S/D) electrodes. Furthermore, the µFE was improved from 0.3 to 2.2 cm2/Vs by enhancing the ION when the In/Ga ratio increased to 1.4 by controlling the In contents within the IGZO active channel. The device also showed robust stabilities under positive/negative gate-bias stresses at 2 MV/cm for 104 s. However, still low a µFE was suggested to originate from two detrimental issues of back-channel effects on spacer sidewall and contact resistance between the channel and S/D electrodes. Alternatively, it was confirmed that the increase in indium contents within the IGZO channel could be a useful way to reduce the contact resistance between the channel and S/D electrodes.
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Hattab, G., Hatzipanayioti, A., Klimova, A., Pfeiffer, M., Klausing, P., Breucha, M., von Bechtolsheim, F., Helmert, J.R., Weitz, J., Pannasch, S.: Investigating the utility of VR for spatial understanding in surgical planning: evaluation of head-mounted to desktop display. Sci. Rep. 11, 1–11 (2021)
Valentine, A., van der Veen, T., Kenworthy, P., Hassan, G.M., Guzzomi, A.L., Khan, R.N., Male, S.A.: Using head mounted display virtual reality simulations in large engineering classes: operating vs observing. Australas. J. Educ. Technol. 37, 119–136 (2021)
Menin, A., Torchelsen, R., Nedel, L.: An analysis of VR technology used in immersive simulations with a serious game perspective. IEEE Comput. Graph. Appl. 38, 57–73 (2018)
Jang, H.J., Lee, J.Y., Kwak, J.H., Lee, D.H., Park, J.H., Lee, B.H., Noh, Y.Y.: Progress of display performances: AR, VR, QLED, OLED, and TFT. J. Inf. Disp. 20, 1–8 (2019)
Lee, S.H., Lee, K.H., Nam, Y.Y., Ko, J.B., Yeom, H.I., Hwang, C.S., Park, S.H.K.: Effect of channel defining layer on the vertical oxide TFTs for the application to the ultra high resolution display. SID Int. Symp. Dig. Tech. Pap. 48, 389–392 (2017)
Hwang, C.S., Kim, Y.H., Choi, J.H., Pi, J.E., Kim, G.H., Yang, J.H., Hwang, C.Y., Kim, J.Y., Kim, H.O., Lee, W.J.: Achieving 1µm pixel pitch display for electronic holography. In: Proceedings of the SPIE, Advances in display technologies X, vol. 11304, pp. 113040L. (2020)
Choi, J.H., Yang, J.H., Pi, J.E., Hwang, C.Y., Kim, Y.H., Kim, G.H., Kim, H.O., Hwang, C.S.: The new route for realization of 1-µm-pixel-pitch high-resolution displays. J. Soc. Inf. Disp. 27, 487–496 (2019)
Choi, J.H., Yang, J.H., Pi, J.E., Hwang, C.Y., Choi, K.H., Kim, H.O., Kwon, O.S., Hwang, C.S.: 1-µm short-channel oxide thin-film transistors with triangular gate spacer. IEEE Electron. Device Lett. 38, 1398–1400 (2017)
Choi, J.H., Pi, J.E., Hwang, C.Y., Yang, J.H., Kim, G.H., Kim, Y.H., Kim, H.O., Kwon, O.S., Park, E.S., Hwang, C.S.: Toward sub-micron oxide thin‐film transistors for digital holography. J. Soc. Inf. Disp. 25, 126–135 (2017)
Moradi, M., Fomani, A.A., Nathan, A.: Effect of gate dielectric scaling in nanometer scale vertical thin film transistors. Appl. Phys. Lett. 99, 223503 (2011)
Nogueira, G.L., Ozório, M.S., Silva, M.M., Morais, R.M., Alves, N.: Middle electrode in a vertical transistor structure using an Sn layer by thermal evaporation. Electron. Mater. Lett. 14, 319 (2018)
Risch, L., Krautschneider, W.H., Hofmann, F., Schafer, H., Aeugle, T., Rosner, W.: Vertical MOS transistors with 70 nm channel length. IEEE Trans. Electron Devices 43, 1495–1498 (1996)
Zhao, T., Cao, M., Saraswat, K.C., Plummer, J.D.: A vertical submicron polysilicon thin-film transistor using a low temperature process. IEEE Electron Device Lett. 15, 415–417 (1994)
Moradi, M., Nathan, A., Haverinen, H.M., Jabbour, G.E.: Vertical transistor with ultrathin silicon nitride gate dielectric. Adv. Mater. 21, 4505–4510 (2009)
Stutzmann, N., Friend, R.H., Sirringhaus, H.: Self-aligned, vertical-channel, polymer field-effect transistors. Science 299, 1881–1884 (2003)
Yang, T., Xia, Z., Shi, D., Ouyang, Y., Huo, Z.: Analysis and optimization of threshold voltage variability by polysilicon grain size simulation in 3D NAND flash memory. IEEE J. Electron Devices Soc. 8, 140–144 (2020)
Jia, X., Jin, L., Hou, W., Wang, Z., Jiang, S., Li, K., Huang, D., Liu, H., Wei, W., Lu, J.: Impact of cycling induced intercell trapped charge on retention charge loss in 3-D NAND flash memory. IEEE J. Electron Devices Soc. 8, 62–66 (2020)
Zou, X., Jin, L., Yan, L., Zhang, Y., Ai, D., Zhao, C., Xu, F., Li, C., Huo, Z.: The influence of grain boundary interface traps on electrical characteristics of top select gate transistor in 3D NAND flash memory. Solid-State Electron. 153, 67–73 (2019)
Seo, J.H., Yoon, Y.J., Yu, E.S., Sun, W.J., Shin, H.S., Kang, I.M., Lee, J.H., Cho, S.J.: Fabrication and characterization of a thin-body poly-Si 1T DRAM with charge-trap effect. IEEE Electron Device Lett. 40, 566–569 (2019)
Jeon, S.H., Benayad, A., Ahn, S.E., Park, S.H., Song, I.H., Kim, C.J., Chung, U.I.: Short channel device performance of amorphous InGaZnO thin film transistor. Appl. Phys. Lett. 99, 082104 (2011)
Nomura, K., Ohta, H., Takagi, A., Kamiya, T., Hirano, M., Hosono, H.: Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors. Nature 432, 488–492 (2004)
Fortunato, E., Barquinha, P., Martins, R.: Oxide semiconductor thin-film transistors: a review of recent advances. Adv. Mater. 24, 2945–2986 (2012)
Nomura, K., Takagi, A., Kamiya, T., Ohta, H., Hirano, M., Hosono, H.: Amorphous oxide semiconductors for high-performance flexible thin-film transistors. Jpn. J. Appl. Phys. 45, 4303 (2006)
Lee, S.Y.: Comprehensive review on amorphous oxide semiconductor thin film transistor. Trans. Electr. Electron. Mater. 21, 235–248 (2020)
Cho, S.Y., Shin, Y.S., Seok, Y.C., Kim, H.W., Yoon, J.Y., Choi, R., Lee, J.H.: Improving electrical stability of a-InGaZnO thin-film transistors with thermally deposited self-assembled monolayers. Electron. Mater. Lett. 16, 451 (2020)
Park, J., Kim, H., Choi, P., Jeon, B., Lee, J., Oh, C., Kim, B., Choi, B.: Effect of ALD- and PEALD-grown Al2O3 gate insulators on electrical and stability properties for a-IGZO thin-film transistor. Electron. Mater. Lett. 17, 299 (2021)
Petti, L., Aguirre, P., Münzenrieder, N., Salvatore, G.A., Zysset, C., Frutiger, A., Büthe, L., Vogt, C., Tröster, G.: Mechanically flexible vertically integrated a-IGZO thin-film transistors with 500 nm channel length fabricated on free standing plastic foil. In: 2013 IEEE International Electron Devices Meet, pp. 11–14 (2013)
Rha, H.S., Jung, J.S., Jung, S.Y., Chung, Y.J., Kim, U.K., Hwang, E.S., Park, B.K., Park, T.J., Choi, J.H., Hwang, C.S.: Vertically integrated submicron amorphous-In2Ga2ZnO7 thin film transistor using a low temperature process. Appl. Phys. Lett. 100, 203510 (2012)
Kim, Y.M., Kang, H.B., Kim, G.H., Hwang, C.S., Yoon, S.M.: Improvement in device performance of vertical thin-film transistors using atomic layer deposited IGZO channel and polyimide spacer. IEEE Electron Device Lett. 38, 1387–1389 (2017)
Choi, S.N., Yoon, S.M.: Implementation of In–Ga–Zn–O thin-film transistors with vertical channel structures designed with atomic-layer deposition and silicon spacer steps. Electron. Mater. Lett. 17, 485–492 (2021)
Leskelä, M., Ritala, M.: Atomic layer deposition chemistry: recent developments and future challenges. Angew. Chem. 42, 5548–5554 (2003)
Miikkulainen, V., Leskelä, M., Ritala, M., Puurunen, R.L.: Crystallinity of inorganic films grown by atomic layer deposition: overview and general trends. J. Appl. Phys. 113, 2 (2013)
Kim, H.R., Kim, G.H., Seong, N.J., Choi, K.J., Kim, S.K., Yoon, S.M.: Comparative studies on vertical-channel charge-trap memory thin-film transistors using In–Ga–Zn–O active channels deposited by sputtering and atomic layer depositions. Nanotechnology 31, 435702 (2020)
Ko, S.B., Seong, N.J., Choi, K.J., Yoon, S.J., Choi, S.N., Yoon, S.M.: Cationic compositional effects on the bias-stress stabilities of thin film transistors using In–Ga–Zn–O channels prepared by atomic layer deposition. J. Mater. Chem. C 7, 6059–6069 (2019)
Ryoo, H.J., Ahn, H.M., Seong, N.J., Choi, K.J., Hwang, C.S., Chang, S.J., Yoon, S.M.: Device characterization of nanoscale vertical-channel transistors implemented with a mesa-shaped SiO2 spacer and an In–Ga–Zn–O active channel. ACS Appl. Electron. Mater. 3, 4189–4196 (2021)
Ryoo, H.J., Seong, N.J., Choi, K.J., Yoon, S.M.: Implementation of oxide vertical channel TFTs with sub-150 nm channel length using atomic-layer deposited IGZO active and HfO2 gate insulator. Nanotechnology 32, 255201 (2021)
Cho, M.H., Kim, M.J., Seul, H., Yun, P.S., Bae, J.U., Park, K.S., Jeong, J.K.: Impact of cation compositions on the performance of thin-film transistors with amorphous indium gallium zinc oxide grown through atomic layer deposition. J. Inf. Disp. 20, 73–80 (2019)
Cho, M.H., Seol, H.J., On, N.R., Kim, T.K., Yun, P.S., Bae, J.U., Park, K.S., Jeong, J.K.: High performance a-IGZO thin‐film transistors grown by atomic layer deposition: cation combinatorial approach. SID Int. Symp. Dig. Tech. Pap. 50, 1259–1262 (2019)
Illiberi, A., Cobb, B., Sharma, A., Grehl, T., Brongersma, H., Roozeboom, F., Gelinck, G., Poodt, P.: Spatial atmospheric atomic layer deposition of InxGayZnzO for thin film transistors. ACS Appl. Mater. Interfaces 7, 3671–3675 (2015)
Yoon, S.J., Seong, N.J., Choi, K.J., Shin, W.C., Yoon, S.M.: Investigations on the bias temperature stabilities of oxide thin film transistors using In–Ga–Zn–O channels prepared by atomic layer deposition. RSC Adv. 8, 25014–25020 (2018)
Yoon, S.M., Seong, N.J., Choi, K.J., Seo, G.H., Shin, W.C.: Effects of deposition temperature on the device characteristics of oxide thin-film transistors using In–Ga–Zn–O active channels prepared by atomic-layer deposition. ACS Appl. Mater. Interfaces 9, 22676–22684 (2017)
Maeng, W.J., Choi, D.W., Park, J., Park, J.S.: Indium oxide thin film prepared by low temperature atomic layer deposition using liquid precursors and ozone oxidant. J. Alloys Compd. 649, 216–221 (2015)
Lee, K.H., Lee, S.H., Cho, S.J., Hwang, C.S., Park, S.H.K.: Improving the electrical performance of vertical thin-film transistor by engineering its back-channel interface. Microelectron. Eng. 253, 111676 (2021)
Hamblen, D.P., Cha-Lin, A.: Angular etching correlations from RIE: application to VLSI fabrication and process modeling. J. Electrochem. Soc. 135, 1816 (1988)
Kim, J.S., Kim, D.H., Cho, S.I., Lee, S.H., Jeong, W.S., Park, S.H.K.: Channel-shortening effect suppression of a high-mobility self-aligned oxide TFT using trench structure. IEEE Electron Device Lett. 42, 1798–1801 (2021)
Bae, S.H., Ryoo, H.J., Yang, J.H., Kim, Y.H., Hwang, C.S., Yoon, S.M.: Influence of reduction in effective channel length on device operations of In–Ga–Zn–O thin-film transistors with variations in channel compositions. IEEE Trans. Electron Devices 68, 6159–6165 (2021)
Kim, W.S., Moon, Y.K., Kim, K.T., Lee, J.H., Park, J.W.: An investigation of contact resistance between metal electrodes and amorphous gallium–indium–zinc oxide (a-GIZO) thin-film transistors. Thin Solid Films 518, 6357–6360 (2010)
Park, J.C., Kim, C.J., Kim, S.I., Song, I.H., Kim, S.W., Kang, D.H., Lim, H., Yin, H., Jung, R.J., Lee, E.H.: Source/drain series-resistance effects in amorphous gallium–indium zinc-oxide thin film transistors. IEEE Electron Device Lett. 29, 879–881 (2008)
Acknowledgements
This work was partly supported by the Technology Innovation Program (20010402, Development of non-planar TFT structures and processes for ultra high resolution display) funded By the Ministry of Trade, Industry and Energy (MOTIE, Korea), and by the National Research Foundation of Korea (NRF) Grant funded by the Korea Government (MSIT) (NRF-2020M3H4A3081897).
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Ahn, HM., Kwon, YH., Seong, NJ. et al. Impact of Strategic Approaches for Improving the Device Performance of Mesa-shaped Nanoscale Vertical-Channel Thin-Film Transistors Using Atomic-Layer Deposited In–Ga–Zn–O Channel Layers. Electron. Mater. Lett. 18, 294–303 (2022). https://doi.org/10.1007/s13391-022-00336-w
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DOI: https://doi.org/10.1007/s13391-022-00336-w