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Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder

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Abstract

Fluxless GaAs-on-Si wafer bonding using Ag/Sn solder was investigated to realize uniform and void-free heterogeneous material integration. The effects of the diffusion barrier, Ag/Sn thickness, and Ar plasma treatment were studied to achieve the optimal fluxless bonding process. Pt on a GaAs wafer and Mo on a Si wafer act as diffusion barriers by preventing the flow of Ag/Sn solder into both the wafers. The bonding strength is closely related to the Ag/Sn thickness and Ar plasma treatment. A shear strength test was carried out to investigate the bonding strength. Under identical bonding conditions, the Ag/Sn thickness was optimized to achieve higher bonding strength and to avoid the formation of voids due to thermal stress. An Ar plasma pretreatment process improved the bonding strength because the Ar plasma removed carbon contaminants and metal-oxide bonds from the metal surface.

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References

  1. F. Niklaus, G. Stemme, J. Q. Lu, and R. J. Gutmann, J. Appl. Phys. 99, 031101 (2006).

    Article  Google Scholar 

  2. J. Steinkirchner, T. Martini, M. Reiche, G. Kästner, and U. Gösele, Adv. Mater. 7, 662 (1995)

    Article  CAS  Google Scholar 

  3. S. H. Choa, Microsyst. Technol. 11, 1187 (2005).

    Article  CAS  Google Scholar 

  4. T. Gessner, T. Otto, M. Wiemer, and J. Frömel, The World of Electronic Packaging and System Integration, p. 307 (2005).

    Google Scholar 

  5. A. Plößl and G. Kräuter, Mater. Sci. Eng. R25, 1 (1999)

    Google Scholar 

  6. C. C. Lee and R. W. Chuang, IEEE Trans. Compon. Packag. Technol. 26, 416 (2003).

    Article  CAS  Google Scholar 

  7. W. Kim, Q. Wang, J. Hwang, M. Lee, K. Jung, S. J. Ham, and C. Moon, Proceedings of Electronic Components and Technology Conference, p. 1103 (2005).

    Google Scholar 

  8. E. Jing, B. Xiong, and Y. Wang, IEEE Trans. Electron. Packag. Manuf. 33, 31 (2010).

    Article  CAS  Google Scholar 

  9. J. S. Kim, T. Yokozuka, and C. C. Lee, Mater. Sci. Eng. A 458, 116 (2007).

    Article  Google Scholar 

  10. A. He and D. G. Ivey, Mater. Sci. Eng. B 106, 33 (2004).

    Article  Google Scholar 

  11. C. H. Sha and C. C. Lee, IEEE Trans. Compon. Packag. Manuf. Technol. 2, 194 (2012).

    Article  CAS  Google Scholar 

  12. T. G. Woo, I. S. Park, K. H. Jung, W. Y. Jeon, Y. K. Hwang, and K. W. Seol, Electron. Mater. Lett. 8, 151 (2012).

    Article  CAS  Google Scholar 

  13. S. Y. Kim, K. Hong, K. Kim, H. K. Yu, W. K. Kim, and J. L. Lee, J. Appl. Phys. 103, 076101 (2008).

    Article  Google Scholar 

  14. T. Lyman and H. E. Boyer, Metal Handbook, American Society for Metals, Ohio (1973).

    Google Scholar 

  15. D. Liang, S. Srinivasan, J. Peters, A. W. Fang, and J. E. Bowers, ECS Trans. 33, 421 (2010).

    Article  CAS  Google Scholar 

  16. S. K. Sen, A. Ghorai and A. K. Bandyopadhyay, and S. Sen, Thin Solid Films 155, 243 (1987).

    Article  CAS  Google Scholar 

  17. M. C. Kim, S. H. Yang, J.-H. Boo, and J. G. Han, Surf. Coat. Technol. 174, 839 (2003).

    Article  Google Scholar 

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Authors and Affiliations

  1. School of Information and Communications, Gwangju Institute of Science and Technology, Gwangju, 500-712, Korea

    Sung-Hwa Eo, Dae-Seon Kim & Jae-Hyung Jang

  2. WCU Department of Nanobio Materials and Electronics, Gwangju Institute of Science and Technology, Gwangju, 500-712, Korea

    Ho-Jung Jeong & Jae-Hyung Jang

  3. Research Institute of Solar and Sustainable Energies, Gwangju Institute of Science and Technology, Gwangju, 500-712, Korea

    Jae-Hyung Jang

Authors
  1. Sung-Hwa Eo
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  2. Dae-Seon Kim
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  3. Ho-Jung Jeong
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  4. Jae-Hyung Jang
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Correspondence to Jae-Hyung Jang.

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Eo, SH., Kim, DS., Jeong, HJ. et al. Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder. Electron. Mater. Lett. 9, 787–791 (2013). https://doi.org/10.1007/s13391-013-6012-8

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  • DOI: https://doi.org/10.1007/s13391-013-6012-8

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