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The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu

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Abstract

In the current study, the influence of thermal ageing on evolution of microstructures in the interfacial region between solders (Sn–37Pb, Sn–3.5Ag–0.5Cu) and copper substrates was investigated. Pb-containing and Pb-free solders were reflowed on Cu substrates at 230 °C for 15 min and were isothermally aged at 100 °C for 24 h. As-reflowed Sn–Pb solder/Cu substrate interfacial region exhibited continuous and layered type of IMC at the interface, and this IMC morphology changed to scallop type with isothermal ageing. SAC solder/Cu as-reflowed samples showed continuous and needle-shaped Cu6Sn5 and Ag3Sn IMCs at the interface. However, in an isothermally aged condition, plate-shaped Cu6Sn5 and flower-shaped Ag3Sn IMCs were found inside the solder matrix. Scanning electron microscopic (SEM) study showed that the thickness of Cu6Sn5 IMC was higher in reflowed Sn–Pb/Cu region than in SAC/Cu region.

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Acknowledgements

Authors thank former students Mr. Ammer Bilal, Mr. Bharath M M, Mr. Syed Dawood and Mr. Mohammed Sohail of AIET for conducting experiments.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Alva’s Institute of Engineering and Technology, Moodabidri, Karnataka, India

    Satyanarayan & M. C. Kumarswamy

  2. Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka (NITK), Mangalore, India

    K. N. Prabhu

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  1. Satyanarayan
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  2. M. C. Kumarswamy
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  3. K. N. Prabhu
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Correspondence to Satyanarayan.

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Satyanarayan, Kumarswamy, M.C. & Prabhu, K.N. The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu. Trans Indian Inst Met 72, 1545–1549 (2019). https://doi.org/10.1007/s12666-019-01583-6

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  • DOI: https://doi.org/10.1007/s12666-019-01583-6

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