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The Effect of Addition of Copper Nanoparticles on Wetting Behaviour of Water During Immersion Quenching

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Abstract

In the present work, the effect of addition of copper nanoparticles to water, in concentrations varying from 0.001–0.1 vol%, on wetting behaviour during immersion quenching of Inconel 600 probe was assessed using near surface temperature probe and contact resistance methods. Quenching in nanofluids resulted in decreased duration of vapour blanket stage and rapid wetting. The wetting front velocity increases with increase in nanoparticle concentration. A stable vapour film was not formed during quenching in nanofluids of 0.05 and 0.1 vol%. Quenching in 0.01, 0.05 and 0.1 vol% nanofluids showed characteristics of repeated wetting process. Quenching in 0.1 vol% nanofluid resulted in the formation of porous layer of nanoparticles.

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Acknowledgments

One of the authors (KNP) gratefully acknowledges the financial support provided by the Department of Science and Technology (DST), Government of India, New Delhi, under a R&D project.

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Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Srinivasnagar, Mangalore, 575025, India

    G. Ramesh & K. Narayan Prabhu

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  1. G. Ramesh
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  2. K. Narayan Prabhu
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Correspondence to K. Narayan Prabhu.

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Ramesh, G., Prabhu, K.N. The Effect of Addition of Copper Nanoparticles on Wetting Behaviour of Water During Immersion Quenching. Trans Indian Inst Met 66, 375–379 (2013). https://doi.org/10.1007/s12666-013-0278-2

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  • DOI: https://doi.org/10.1007/s12666-013-0278-2

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