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Forming conditions of blisters during solution heat treatment of Al–Si alloy semi-solid die castings

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Abstract

In the present study, numerical simulation method was used to analyze the conditions, resulting in the formation of blisters during solution heat treatment. Blister formation is considered to occur as the height of blister reaches 5 μm. The effects of process parameters on the magnitude of the forming temperatures of blister (Tb) were discussed. Two kinds of Al–Si alloys were used to analyze the effect of mechanical properties of the alloys on blister forming conditions. Simulation results show that decreasing the initial pressure in gas hole, the long-short axial ratio of gas hole and the size of gas hole, as well as increasing the depth of gas hole and the strength of alloy are helpful to increase the critical temperature of forming blister. These conclusions are helpful for casters to understand the conditions controlling blister formation during solution heat treatment and take actions to avoid the blister defects.

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Acknowledgements

This study was financially supported by the National Key Research and Development Program of China (No. 2016YFB0301003) and Shenzhen Science and Technology Innovation Commission under Projects (Nos. JCYJ20170307110223452, KQJSCX20170328155402991 and KQTD20170328154443162).

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Authors and Affiliations

  1. National Engineering and Technology Research Center for Nonferrous Metal Matrix Composites, General Research Institute for Nonferrous Metals, Beijing, 100088, China

    Hong-Xing Lu, Qiang Zhu, Stephen P. Midson, Wen-Ying Qu, Fan Zhang & Da-Quan Li

  2. Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China

    Qiang Zhu

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  1. Hong-Xing Lu
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  2. Qiang Zhu
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  3. Stephen P. Midson
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  4. Wen-Ying Qu
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  5. Fan Zhang
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  6. Da-Quan Li
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Correspondence to Qiang Zhu.

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Lu, HX., Zhu, Q., Midson, S.P. et al. Forming conditions of blisters during solution heat treatment of Al–Si alloy semi-solid die castings. Rare Met. 42, 3851–3858 (2023). https://doi.org/10.1007/s12598-018-1085-z

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  • DOI: https://doi.org/10.1007/s12598-018-1085-z

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