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Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloy

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Abstract

The variation of bonding ratio in the press bonding of TC4 alloy at temperatures from 850 to 900 °C, pressures from 10 to 30 MPa, and time from 5 to 15 min was investigated. The bonding ratio increases with the increase of temperature, time and pressure. The maximum bonding ratio, i.e. 98 %, can be obtained at 900 °C, 30 MPa and 15 min. The significance and interaction of bonding parameters with the bonding ratio were investigated. The results demonstrate that the effect of pressure on the bonding ratio is the most effective and the effect of temperature is secondary, while the effect of time is not very powerful. The interaction of bonding parameter on the bonding ratio exists but that is distinguishing in different bonding parameter ranges. It is concluded that increasing pressure can be considered as the primary method to increase the bonding ratio.

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Acknowledgments

This work was financially supported by the National Natural Science Foundation of China (No. 51275416).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an, 710072, China

    Hong Li, Miao-Quan Li, Wei-Xin Yu & Hong-Bin Liu

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  1. Hong Li
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  2. Miao-Quan Li
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  3. Wei-Xin Yu
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  4. Hong-Bin Liu
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Correspondence to Miao-Quan Li.

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Li, H., Li, MQ., Yu, WX. et al. Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloy. Rare Met. 35, 235–241 (2016). https://doi.org/10.1007/s12598-014-0330-3

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  • DOI: https://doi.org/10.1007/s12598-014-0330-3

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