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Microstructure and formation mechanism of SHS joining between Cf/Al composites and TiAl intermetallic with Al–Ni–CuO interlayer

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Abstract

In this study, it was reported a novel approach for joining Cf/Al composites and TiAl intermetallic by self-propagating high-temperature synthesis (SHS). Mixed powders of 14Al–2Ni–3CuO were used as the SHS interlayer, and differential thermal analysis test of Al–Ni–CuO interlayer was conducted to analyze the exothermic characteristic. Sound joint was got by SHS joining under the conditions of 600 °C, 30 min, and 5 MPa. The joint was characterized by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD). TiAl3 and NiAl3 are, respectively, formed in the TiAl/interlayer and Cf/Al/interlayer interfaces. Reaction products of Ni2Al3, NiAl3, Al2O3, and Cu were observed in the interlayer. And the formation mechanism of SHS joining was investigated.

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Acknowledgments

This study was financially supported by the National Natural Science Foundation of China (No. 51075101).

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Authors and Affiliations

  1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Zhuo-Ran Li, Guang-Jie Feng, Kai Xu & Xiang-Long Zhang

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  1. Zhuo-Ran Li
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  2. Guang-Jie Feng
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  3. Kai Xu
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  4. Xiang-Long Zhang
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Correspondence to Zhuo-Ran Li.

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Li, ZR., Feng, GJ., Xu, K. et al. Microstructure and formation mechanism of SHS joining between Cf/Al composites and TiAl intermetallic with Al–Ni–CuO interlayer. Rare Met. 34, 17–21 (2015). https://doi.org/10.1007/s12598-013-0193-z

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  • DOI: https://doi.org/10.1007/s12598-013-0193-z

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