Skip to main content
SpringerLink
Log in

Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

  • Published:
Rare Metals Aims and scope Submit manuscript

Abstract

The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of applying constant voltage and distilled water environment. ECM resistance was determined from the current-time curves. The microstructure and composition of ECM dendrite products were analyzed by SEM/EDS and XRD. It was found that the ECM resistance of Ag-plated Cu composite powder-filled ECAs was evidently higher than that of pure Ag powder-filled ECAs. The Ag:Cu ratio of composite powder in ECAs had notable influence on ECM resistance, which was enhanced with the decrease of Ag:Cu ratios. The composition of dendrites formed between cathode and anode during ECM process was not uniform for Ag-plated Cu-filled ECAs. An ECM inhibiting mechanism of Ag-plated Cu composite powder was proposed according to analysis of the electrochemical impedance spectroscopy, Tafel plot and dendrite composition.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Krumbein S.J., Metallic electromigration phenomena, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988, 11(1): 5.

    Article  Google Scholar 

  2. Harsányi G., Electrochemical processes resulting in migrated short failures in microcircuits, IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part A, 1995, 18(3): 602.

    Article  Google Scholar 

  3. Harsányi G., Copper may destroy chip-level reliability, IEEE Electron Device Letters, 1999, 20(1): 5.

    Article  Google Scholar 

  4. Lee S.B., Yoo Y.R., Jung J.Y., Park Y.B., Kim Y.S., and Joo Y.C., Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board, Thin Solid Films, 2006, 504(1–2): 294.

    Article  CAS  Google Scholar 

  5. Noh B.I., Lee J.B., and Jung S.B., Effect of surface finish material on printed circuit board for electrochemical migration, Microelectronics Reliability, 2008, 48(4): 652.

    Article  CAS  Google Scholar 

  6. Guan Y. C., and Han K.N., An electrochemical study on the dissolution of copper and silver from silver-copper alloys, Journal of the Electrochemical Society, 1995, 142(6): 1819.

    Article  CAS  Google Scholar 

  7. Zhu H., and Gan F.X., Corrotion failure of complex electrical conductive materials filled with copper and silver powders, Journal of Chinese Society for Corrosion and Protection, 2005, 25(4): 245.

    CAS  Google Scholar 

  8. Mir I., and Kumar D., Recent advances in isotropic conductive adhesive for electronics packaging applications, International Journal of Adhesion and Adhesives, 2008, 28(7): 362.

    Article  CAS  Google Scholar 

  9. Lin J.C., and Chan J.Y., On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied d.c. field, Materials Chemistry and Physics, 1996, 43(3): 256.

    Article  CAS  Google Scholar 

  10. DiGiacomo G., Current-leakage kinetics across tinned Cr/Cu lands having epoxy overlay, IEEE Transactions on Component, Hybrids, and Manufacturing Technology, 1985, 8(4): 440.

    Article  Google Scholar 

  11. Yang S., Wu J., and Christou A., Initial stage of silver electrochemical migration degradation, Microelectronics Reliability, 2006, 46(9–11): 1915.

    Article  CAS  Google Scholar 

  12. Despić A.R., Diggle, J.W., and Bockris J.O.M., Mechanism of the formation of zinc dendrites, Journal of the Electrochemical Society, 1968, 115(5): 507.

    Article  Google Scholar 

  13. Hamilton J.C., Farmer J.C., and Anderson R.J., In situ raman spectroscopy of anodic films formed on copper and silver in sodium hydroxide solution, Journal of the Electrochemical Society, 1986, 133(4): 739.

    Article  CAS  Google Scholar 

  14. Hampson N.A., Lee J.B., and Morley J.R., Electrochemistry of oxides of silver-a short review, Electrochemical Acta, 1971, 16(5): 637.

    Article  CAS  Google Scholar 

  15. Vvedenskii A., Grushevskaya S., Kudryashov D., and Kuznetsova T., Kinetic peculiarities of anodic dissolution of silver and Ag-Au alloys under the conditions of oxide formation, Corrosion Science, 2007, 49(12): 4523.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China

    Xiaoyun Zhu, Jinming Long & Xiaoli Liu

  2. Faculty of Metallurgy and Energy Engineering, Kunming University of Science and Technology, Kunming, 650093, China

    Yuanlong Liu

Authors
  1. Xiaoyun Zhu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yuanlong Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jinming Long
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Xiaoli Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jinming Long.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhu, X., Liu, Y., Long, J. et al. Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives. Rare Metals 31, 64–70 (2012). https://doi.org/10.1007/s12598-012-0464-0

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12598-012-0464-0

Keywords

Search

Navigation