Electrodeposition of the Sn-58 wt.%Bi layer for low-temperature soldering

Abstract

The electroplating characteristics and deposition layer of a Sn-Bi eutectic alloy applicable to low-temperature soldering were investigated. A methane sulphonate electrolyte was fabricated and the current density was focused in order to achieve an eutectic Sn-Bi composition. The electroplating characteristics, including the polarization curve and deposition thickness with plating time, were also studied. As experimental results, a polarization curve showed a Sn-Bi codeposition occurred under a −0.5 V electropotential. The Bi content in the Sn-Bi deposit decreased with an increasing current density, such as 99.42 wt.% for −10 mA/cm² and 42.27 wt.% for −40 mA/cm². The thickness of the electroplated layer increased with the plating time, while a relatively uniform thickness was obtained in a short plating time, such as less than 40 min. The eutectic deposition of Sn-58.2 wt.%Bi was successfully fabricated by plating at −30 mA/cm² for 30 min.