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Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing

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Abstract

Reducing energy consumption has become a critical issue in manufacturing. The semiconductor industry in particular is confronted with environmental regulations on pollution associated with electric energy, chemical, and ultrapure water (UPW) consumptions. This paper presents the results of an evaluation of the environmental impacts during chemical mechanical polishing (CMP), a key process for planarization of dielectrics and metal films in ultra-large-scale integrated circuits. The steps in the CMP process are idling, conditioning, wetting, wafer loading/unloading, head dropping, polishing, and rinsing. The electric energy, CMP slurry, and UPW consumptions associated with the process and their impacts on global warming are evaluated from an environmental standpoint. The estimates of electric energy, slurry, and UPW consumptions as well as the associated greenhouse gas emissions presented in this paper will provide a technical aid for reducing the environmental burden associated with electricity consumption during the CMP process.

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Authors and Affiliations

  1. School of Mechanical Engineering, Pusan National University, Busandaehak-ro 63 beon-gil, Geumjeong-gu, Busan, 609-735, South Korea

    Hyunseop Lee, Sunjoon Park & Haedo Jeong

Authors
  1. Hyunseop Lee
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  2. Sunjoon Park
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  3. Haedo Jeong
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Correspondence to Hyunseop Lee.

Additional information

Recommended by Associate Editor In-Ha Sung

Hyunseop Lee received his B.S., M.S., and Ph.D degrees in Mechanical Engineering from Pusan National University. He worked in the Laboratory for Manufacturing and Sustainability (LMAS) at the University of California, Berkeley, USA as a postdoctoral researcher in 2011. He is currently a postdoctoral researcher in the School of Mechanical Engineering at Pusan National University, Korea. His research interests include (chemical mechanical) polishing of electronic materials, grinding, ultrasonicassisted particle deposition, and sustainable manufacturing.

Sunjoon Park received his B.S. and M.S. degrees in Mechanical Engineering from Pusan National University, Korea. He is currently a Ph.D candidate in the School of Mechanical Engineering at Pusan National University. His research fields are multi-sensor monitoring of manufacturing processes and endpoint detection system for chemical mechanical polishing.

Haedo Jeong is a professor in the School of Mechanical Engineering at Pusan National University and a CEO of G&P Technology, Korea. He received his B.S. and M.S. degrees from Pusan National University and Korea Advanced Institute of Science and Technology (KAIST), respectively. In 1994, he received his Ph.D degree in Mechanical Engineering from Tokyo University, Japan. His research fields are chemical mechanical polishing (CMP), grinding, polisher and consumable design, and post-CMP cleaning.

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Lee, H., Park, S. & Jeong, H. Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing. J Mech Sci Technol 27, 511–518 (2013). https://doi.org/10.1007/s12206-012-1241-6

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  • DOI: https://doi.org/10.1007/s12206-012-1241-6

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