Skip to main content
Log in

Role of working fluids on the cooling of discrete heated modules: a numerical approach

  • Published:
Sādhanā Aims and scope Submit manuscript

Abstract

The study has focused on the role of working fluids (air, water and FC-72) on the cooling of discrete heated modules under free, forced and mixed convection medium. Three non-identical protruding discrete heat sources are arranged at different positions on a substrate board following golden mean ratio (GMR). Numerical simulations for these heat sources are carried out using a commercial software (ANSYS-Icepak R-15) to simulate their flow and temperature fields under three different modes of heat transfer. Results suggest that the temperature of the heat sources is a strong function of their size, position on the substrate board, the velocity of the fluid and type of working fluid used. A correlation has been proposed for the temperature of these heat sources keeping in mind their strong dependence on the afore-mentioned parameters. It has been found that water can be used for better heat removal from the heat sources due to its high boiling point. The whole idea gives a clear insight to the electronic cooling engineers regarding the selection of working fluids and modes of heat transfer for the cooling of electronic components.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11

Similar content being viewed by others

References

  1. Peterson G P and Ortega A 1990 Thermal control of electronic equipment and devices. Adv. Heat Transf. 20: 181–314

    Article  Google Scholar 

  2. Reynell M 1990 Major causes for failure of electronic components. U.S. Air Force Avionics Integrity Program

  3. Lasance C J and Simons R E 2005 Advances in high-performance cooling for electronics. Electron. Cool. Mag. 11: 22–39

    Google Scholar 

  4. Overholt M R, McCandless A, Kelly K W, Becnel C and Motakef S 2005 Micro-jet arrays for cooling of electronic equipment. In: Proceedings of the 3rd ASME International Conference on Micro-channels and Mini-channels, pp. 249–252

  5. Mahaney H V, Incropera F P and Ramadhyani S 2007 Measurement of mixed-convection heat transfer from an array of discrete sources in a horizontal rectangular channel with and without surface augmentation. Exp. Heat Transf. 3: 215–237

    Article  Google Scholar 

  6. Hotta T K, Muvvala P and Venkateshan S P 2013 Effect of surface radiation heat transfer on the optimal distribution of discrete heat sources under natural convection. Heat Mass Transf. 49: 207–217

    Article  Google Scholar 

  7. Fabbri M and Dhir V K 2005 Optimized heat transfer for high power electronic cooling using arrays of the microjet. ASME J. Heat Transf. 127: 760–769

    Article  Google Scholar 

  8. Wang D, Yu E and Pezekwas A 1990 A computational study of two-phase jet impingement cooling of an electronic chip. In: Proceedings of the 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 10–15

  9. Baker E 1972 Liquid cooling of microelectronic devices by free and forced convection microelectronic and reliability. Microelectron. Reliab. 11: 213–222

    Article  Google Scholar 

  10. Leena R, Renjith R V and Prakash M J 2015 Experimental and numerical investigations on steady and unsteady jet impingement cooling for high power electronics. IEEE Trans. Components, Packag. Manuf. Technol. 5: 636–640

    Article  Google Scholar 

  11. Heindel T J, Ramadhyani S and Incropera F R 1995 Conjugate natural convection from an array of discrete heat sources part-I – two and three dimensional model validations. Int. J. Heat Mass Transf. 16: 501–510

    Google Scholar 

  12. Incropera F P, Kerby J S, Moffatt D F and Ramadhyani S 1986 Convective heat transfer from discrete heat sources in a rectangular channel. Int. J. Heat Mass Transf. 29: 1051–1058

    Article  Google Scholar 

  13. Joshi Y, Wilson T and Hazard S J 1989 An experimental study of natural convection cooling of an array of heated protrusions in a vertical channel in water. ASME J. Electron. Packag. 111: 33–40

    Article  Google Scholar 

  14. Sharma C S, Zimmermann S, Tiwari M K, Michel B and Poulikakos D 2012 Optimal thermal operation of liquid-cooled electronic chips. Int. J. Heat Mass Transf. 55: 1957–1969

    Article  Google Scholar 

  15. Bhowmik H and Tou K W 2005 Study of transient forced convection heat transfer from discrete heat sources in an FC-72 cooled vertical channel. Int. J. Therm. Sci. 44: 499–505

    Article  Google Scholar 

  16. Park K A and Bergles A E 1987 Natural convection heat transfer characteristics of simulated microelectronic chips. ASME J. Electron. Packag. 109: 90–96

    Google Scholar 

  17. Liu Y and Phan-Thien N 2000 An optimum spacing problem for three chips mounted on a vertical substrate in an enclosure. Numer. Heat Transf. Part A Appl. 37: 613–630

    Article  Google Scholar 

  18. Roache P J 1994 Perspective: a method for uniform reporting of grid refinement studies. J. Fluid Eng. 116: 405–413

    Article  Google Scholar 

  19. fluorinert-electronic-liquid-fc-72.pdf

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to TAPANO KUMAR HOTTA.

Appendices

Nomenclature

g :

acceleration due to gravity, 9.81 m/\(\hbox {s}^{2}\)

Gr :

Grashof number, \(\dfrac{g \beta \Delta T L^3}{\nu ^2}\)

h :

heat transfer coefficient, W/\(\hbox {m}^{2}\hbox { K}\)

k :

thermal conductivity, W/m K

L :

length of the heat source, m

q :

heat flux, W/\(\hbox {m}^{2}\)

\(\textit{q}^*\) :

non-dimensional heat flux, \(\dfrac{\Delta T_{ref}}{T_{\infty }}\)

Q :

heat supplied, W

Re :

Reynolds number, \(\dfrac{V L}{\nu ^2}\)

Ri :

Richardson number, \(\dfrac{Gr}{Re^2}\)

T :

temperature, K

V :

velocity of fluid, m/s

\(\textit{V}^*\) :

non-dimensional velocity, \(\dfrac{V}{V_{max}}\)

Greek symbols

\(\beta \) :

isobaric thermal expansion coefficient of fluid, \(\dfrac{1}{T_{mean}}\), \(\hbox {K}^{-1}\)

\(\Delta T_{ref}\) :

reference temperature, \(\dfrac{q L}{k_f}\), K

\(\nu \) :

kinematic viscosity of fluid, \(\hbox {m}^2\)/s

\(\theta \) :

non-dimensional temperature, \(\dfrac{T_{max} - T_{\infty }}{\Delta T_{ref}}\)

Subscripts

\(\infty \) :

ambient

f:

fluid

max:

maximum

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

PATIL, N.G., HOTTA, T.K. Role of working fluids on the cooling of discrete heated modules: a numerical approach. Sādhanā 43, 187 (2018). https://doi.org/10.1007/s12046-018-0950-7

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s12046-018-0950-7

Keywords

Navigation