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Forced Convection from IC Chips on Printed Circuit Boards Generating High Heat Fluxes

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Abstract

This paper reports computational research on forced convection air cooling of high thermal conductivity printed circuit boards for dissipating high heat fluxes. Flowing air velocities of 2–6 m/s are used at uniform heat flux values. The full three-dimensional, steady, laminar, incompressible, developing flow are studied. Finite element-based commercially available Comsol Multiphysics 4.3 b software is used to solve Navier–Stokes equations to study the coupling between heat transfer in solids and fluids. Single-layer and multi-layered copper clad boards having thermal conductivities of 8.8 and 40.5 W/m K, respectively, are considered as substrate materials. Effect of thermal conductivity on heat transfer characteristics under forced convection air cooling has been studied. Fifteen aluminum discrete square heat sources of sizes \(15\times 15 \times 5\) mm each are mounted on the substrate board that mimics electronic chips on printed circuit boards. Two different thermal conductivity substrate boards mounted with aluminum heat sources are considered for high heat flux values of 4000, 8000, 12,000 \(\hbox {W/m}^2\), respectively. Results of temperature plots show that a multilayer copper clad board is suitable for all high heat flux values considered for the configuration used in this study. Single-layer copper clad substrate board is capable of dissipating heat from electronic components efficiently for the heat flux values of 4000–12000 \(\hbox {W/m}^2\) except in case of high heat flux value of 12,000 \(\hbox {W/m}^2\) with a velocity of 2 m/s.

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Acknowledgements

The author acknowleges his gratitude to Indian Institute of Technology Madras, Chennai for providing sofisticated computing facitities to carry out the present simulation work.

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  1. Department of Mechanical Engineering, College of Engineering, Pune, 411005, India

    Shankar Durgam

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  1. Shankar Durgam
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Correspondence to Shankar Durgam.

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Durgam, S. Forced Convection from IC Chips on Printed Circuit Boards Generating High Heat Fluxes. J. Inst. Eng. India Ser. C 102, 933–940 (2021). https://doi.org/10.1007/s40032-021-00704-9

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