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Investigations on Voids Formation in Cu–Mg Alloy During Continuous Extrusion

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Abstract

In this article, the microstructure evolution and the formation of void defects in continuous extruded Cu–Mg alloy were investigated. The results showed that hot deformation, grain rearrangement, grain rotation, and grain boundary sliding occurred in the right-angle bending zone and extending extrusion zone. Voids formed in the extending deformation zone and grew up in the extrusion deformation core. The uncoordinated reaction of the grain boundary and dislocation blocked grain boundary slide in the triple grain boundary junctions, leading to nucleation of voids. Severe deformation and grain rearrangement resulted in the expansion of voids consequently through with the grain boundary slide.

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Acknowledgement

This study was supported by the National Natural Science Foundation of China (Grant 51601227), National Key R& D Program of China (Grant 2016YFB0301301), China postdoctoral Science Foundation (Grant 161881), and grants from the project of innovation-driven plan and project of State Key Laboratory of Powder Metallurgy, Central South University, Changsha, China.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, People’s Republic of China

    Yuan Yuan, Zhou Li, Zhu Xiao & Ziqian Zhao

  2. China Railway Construction Electrification Bureau Group Kang Yuan New Materials CO., LTD, Jiangyin, 214521, People’s Republic of China

    Yuan Yuan

  3. State Key Laboratory of Powder Metallurgy, Changsha, 410083, People’s Republic of China

    Zhou Li

  4. Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Changsha, 410083, People’s Republic of China

    Zhu Xiao

Authors
  1. Yuan Yuan
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  2. Zhou Li
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  3. Zhu Xiao
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  4. Ziqian Zhao
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Correspondence to Zhu Xiao.

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Yuan, Y., Li, Z., Xiao, Z. et al. Investigations on Voids Formation in Cu–Mg Alloy During Continuous Extrusion. JOM 69, 1696–1700 (2017). https://doi.org/10.1007/s11837-017-2469-5

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  • DOI: https://doi.org/10.1007/s11837-017-2469-5

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