Skip to main content
SpringerLink
Log in

The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder

  • Phase Transformations
  • Research Summary
  • Published:
JOM Aims and scope Submit manuscript

Abstract

During soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated solder melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate the thickness of any intermetallic layer formed under conditions of simultaneous dissolution in the undersaturated solder melt. The main features of reactive phase formation at the solid metalliquid solder interface are illustrated using the Co-Sn couple with the growing CoSn3 (250°C) and CoSn2 (350°C and 450°C) layers as examples.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. D.R. Frear, JOM, 51(3) (1999), pp. 22–27.

    Article  CAS  Google Scholar 

  2. W.H. Tao et al., Chem. Mater., 13 (2001), pp. 1051–1056.

    Article  CAS  Google Scholar 

  3. M.Y. Chiu, S.S. Wang, and T.H. Chuang, J. Electronic Mater., 31 (2002), pp. 494–499.

    Article  ADS  CAS  Google Scholar 

  4. M.O. Alam, Y.C. Chan, and K.N. Tu, J. Appl. Phys., 94 (2003), pp. 4108–4115.

    Article  ADS  CAS  Google Scholar 

  5. Jeong-Won Yoon et al., J. Electronic Mater., 33 (2004), pp. 1190–1199.

    Article  ADS  CAS  Google Scholar 

  6. Hwa-Teng Lee et al., Mater. Sci. Eng. A, 407 (2005), pp. 36–44.

    Article  Google Scholar 

  7. P.L. Liu and J.K. Shang, Scripta Mater., 53 (2005), pp. 631–634.

    Article  Google Scholar 

  8. M.J. Rizvi et al., J. Alloys Comp., 407 (2006), pp. 208–214.

    Article  CAS  Google Scholar 

  9. Chao-hong Wang and Sinn-wen Chen, Acta Mater., 54 (2006), pp. 247–253.

    Article  CAS  Google Scholar 

  10. Oladele A. Ogunseitan, JOM, 59(7) (2007), pp. 12–17.

    Article  Google Scholar 

  11. Katsuaki Suganuma et al. (Presentation at the MRS 2007 Spring Meeting, San Francisco, CA, April 9–13, 2007), E1.6.

  12. Thomas Bieler et al. (Presentation at the MRS 2007 Spring Meeting, San Francisco, CA, April 9–13, 2007), E4.6.

  13. Eric Chason et al. (Presentation at the MRS 2007 Spring Meeting, San Francisco, CA, April 9–13, 2007), E2.4.

  14. K. Ursula, K. Moon, and C. Handwerker (Presentation at the Materials Science and Technology 2007 Conference and Exhibition, Detroit, MI, September 16–20, 2007).

  15. I.E. Anderson et al. (Presentation at the Materials Science and Technology 2007 Conference and Exhibition, Detroit, MI, September 16–20, 2007).

  16. K.A. Grossklaus et al. (Presentation at the Materials Science and Technology 2007 Conference and Exhibition, Detroit, Mi, September 16–20, 2007).

  17. K.N. Subramanian, editor, Lead-Free Electronic Solders (Berlin-Heidelberg: Springer, 2007).

    Google Scholar 

  18. K.N. Tu, Solder Joint Technology (Berlin-Heidelberg: Springer, 2007).

    Google Scholar 

  19. K. Hauffe, Reaktionen in und an festen Stoffen (Berlin: Springer, 1955).

    Google Scholar 

  20. W. Seith, Diffusion in Metallen (Berlin: Springer, 1955).

    Google Scholar 

  21. J.A. Hedvall, Solid State Chemistry (Amsterdam: Elsevier, 1966).

    Google Scholar 

  22. V.I. Dybkov, Reaction Diffusion and Solid State Chemical Kinetics (Kyiv: The IPMS Publications, 2002), www.dybkov.kiev.ua.

    Google Scholar 

  23. A. Lang and W. Jeitschko, Z. Metallkunde, 87 (1996), pp. 759–764.

    CAS  Google Scholar 

  24. M. Jiang et al., Calphad, 28 (2004), pp. 213–220.

    Article  CAS  Google Scholar 

  25. H. Okamoto, J. Phase Equil. Diffusion, 27 (2006), p. 308.

    Article  CAS  Google Scholar 

  26. Chao-hong Wang and Sinn-wen Chen, J. Mater. Res., 22 (2007), pp. 3404–3409.

    Article  CAS  Google Scholar 

  27. K.P. Gurov, B.A. Kartashkin, and Yu. E. Ugaste, Vzaimnaya Diffusiya v Mnogofaznikh Metallicheskikh Sistemakh (Moskwa: Nauka, 1981).

    Google Scholar 

  28. E.E. Havinga, H. Damsma, and P. Hokkeling, J. Less-Common Metals, 27 (1972), pp. 169–186.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Physical Chemistry of Inorganic Materials at the Institute of Problems of Materials Science, Kyiv, 03180, Ukraine

    V. I. Dybkov

Authors
  1. V. I. Dybkov
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to V. I. Dybkov.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Dybkov, V.I. The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder. JOM 61, 76–79 (2009). https://doi.org/10.1007/s11837-009-0015-9

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11837-009-0015-9

Keywords

Search

Navigation