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Materials issues in area-array microelectronic packaging

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Abstract

The important issues in advanced area-array electronic packaging for semiconductor devices are materials driven. Some of the processing-driven materials issues include the effect of introducing a silicon device interface with copper pads and a low-κ dielectric, the effect of decreasing pitch and feature size on the package interconnects, the development and implementation of organic substrates, and advanced underfills for fine-pitch flip-chip applications. From a materials reliability aspect, important materials issues include enhanced solder interconnect reliability, α-particle-induced soft errors, and the introduction of lead-free solder alloys.

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Authors and Affiliations

  1. Sematech, 2706 Montopolis, 78741, Austin, Texas

    D. R. Frear

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  1. D. R. Frear
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Additional information

Darrel R. Frear earned his Ph.D. in materials science at the University of California at Berkeley in 1987. He is currently manager of the low-cost flip-chip project at Sematech. Dr. Frear is also a member of TMS.

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Frear, D.R. Materials issues in area-array microelectronic packaging. JOM 51, 22–27 (1999). https://doi.org/10.1007/s11837-999-0023-9

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  • DOI: https://doi.org/10.1007/s11837-999-0023-9

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