Abstract
A soy-based formaldehyde-free adhesive consisting of soy flour (SF), polyethylenimine (PEI), maleic anhydride (MA) and NaOH was investigated for making three-layer particleboard. The weight ratio of SF/PEI/MA/NaOH was 7/1.0/0.32/0.1. Hot-press temperature, hot-press time, particleboard density and adhesive usage were optimized in terms of enhancing the modulus of rupture (MOR), modulus of elasticity (MOE) and internal bond strength (IB) of the resulting particleboard. The MOR, MOE and IB met the minimum industrial requirements of M-2 particleboard under the following variables: hot-press temperature of 170 °C, hot-press time of 270 s, the adhesive usage of surface particles at 10 wt%, the adhesive usage of the core particles at 8 wt%, and the targeted particleboard density of 0.80 g/cm3.
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References
Youngquist JA (1999) Wood handbook. Forest Product laboratory, MI
International Agency for Research on Cancer classifies formaldehyde as carcinogenic to humans, International Agency for Research on Cancer, Press release # 153 (2004)
Liu K (1997) Soybeans-chemistry, technology, and utilization. International Thomson Publishing, New York
Li K, Peshkova S, Geng X (2004) Investigation of soy protein-Kymene adhesive systems for wood composites. J Am Oil Chem Soc 81:487–491
Li K (2002) Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives. US Patent 7,252,735
Li K, Liu Y (2006) Modified protein adhesives and lignocellulosic composites made from the adhesives. US Patent 7,060,798
Huang J, Li K (2008) New soy flour-based adhesive for making interior type II plywood. J Am Oil Chem Soc 85:63–70
Acknowledgments
This project was supported by a grant from the National Research Initiative Competitive Grants Program of the USDA. We thank Cargill Incorporated (Minneapolis, MN) for the soy flour and Flakeboard (Albany, OR) for the wood particles.
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Gu, K., Li, K. Preparation and Evaluation of Particleboard with a Soy Flour-Polyethylenimine-Maleic Anhydride Adhesive. J Am Oil Chem Soc 88, 673–679 (2011). https://doi.org/10.1007/s11746-010-1706-7
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DOI: https://doi.org/10.1007/s11746-010-1706-7