Abstract
Polymeric encapsulation or packaging materials have gained great significance on efficacy and reliability of light-emitting diodes (LEDs). In one of the four-wheeler applications, headlamp illumination issue was observed due to failure of LED polymeric coating during the running condition. In the present work, a set of characterization techniques were employed to identify the root causes of LED failure caused by the delamination of polymeric encapsulation coating and provided the possible remedies. For root cause analysis and further failure prevention, field failure LEDs and defect-free LEDs were analyzed. The LED coating was scratched from field failure and defect-free LEDs surface, and set of characterization methods have been employed for chemical, thermal, mechanical, and morphological analysis. The filler loading and their dispersion played major role in delamination of the polydimethylsiloxane (PDMS) coating. From the set of experiments, it was observed that the delamination of the coatings was caused by the higher filler content and their random dispersion. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) were used to analyze the thermal characteristics of LED coatings. Scanning electron microscopy (SEM) and polarized optical microscopy (POM) were used to explore the morphological analysis of LED coatings. SEM and TGA analysis confirmed the presence of titanium dioxide (TiO2) filler and concentration in the PDMS coating. The concentrations and dispersions of titanium dioxides principally showed the major influence on defected and defect-free LED coatings.
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Authors would like to thank Uno Minda Limited for their support and funding for characterization and analysis process. The authors are also thankful to the management team of Uno Minda Limited for every possible support and motivation.
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Naikwadi, A.T., Chandkoti, I., Mali, M. et al. Failure Investigation on Delamination of Polydimethylsiloxane-Based Light-Emitting Diode Encapsulating Coating. J Fail. Anal. and Preven. 23, 2683–2692 (2023). https://doi.org/10.1007/s11668-023-01808-3
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DOI: https://doi.org/10.1007/s11668-023-01808-3