Abstract
Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800 °C under pressures from 5 to 40 MPa and dwell times between 60 and 180 min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800 °C during 60 min using a pressure of 20 MPa. The bond interface is thin (less than 10 µm) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.
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Acknowledgments
This research is sponsored by FEDER funds through the program COMPETE—Programa Operacional Factores de Competitividade—and by national funds through FCT—Fundação para a Ciência e a Tecnologia—, under the project UID/EMS/00285/2013. The authors are grateful to CEMUP—Centro de Materiais da Universidade do Porto for expert assistance with SEM.
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Simões, S., Viana, F., Ramos, A.S. et al. Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers. J. of Materi Eng and Perform 27, 5064–5068 (2018). https://doi.org/10.1007/s11665-018-3207-z
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DOI: https://doi.org/10.1007/s11665-018-3207-z