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Microstructure and Mechanical Properties of AlN/Cu Brazed Joints

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Abstract

In this study, the AlN/Cu bonding was explored using the brazing technique. During AlN/Cu brazing, the temperature was set at 800, 850, and 900 °C for 10, 20, 30, and 60 min, respectively. We studied the bonding mechanism, microstructure formation, and the mechanical characteristics of the bond. The reaction layer developed at the interface of AlN/Cu is observed to be TiN. The activation energy of TiN is about 149.91 kJ/mol. The reaction layer thickness is linearly dependent on the temperature and duration at 800 and 850 °C for 60 min and 900 °C for 30 min. However, the growth of the reactive layers decreases gradually at 900 °C when the duration changed from 30 to 60 min. The strength of the specimens with thickness ranging between 1 and 1.5 μm is 40-51 MPa.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Taipei University of Technology, Taipei, 106, Taiwan

    Cherng-Yuh Su

  2. Institute of Manufacturing Technology, National Taipei University of Technology, Taipei, 106, Taiwan

    Cherng-Yuh Su & Min-Sheng Lo

  3. Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan

    C. T. Pan

  4. Center for Nanoscience& Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan

    C. T. Pan

  5. National Science Council Core Facilities Laboratory for Nano-Science and Nano-Technology in Kaohsiung-Pingtung Area, Kaohsiung, Taiwan

    C. T. Pan

Authors
  1. Cherng-Yuh Su
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Correspondence to C. T. Pan.

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Su, CY., Pan, C.T. & Lo, MS. Microstructure and Mechanical Properties of AlN/Cu Brazed Joints. J. of Materi Eng and Perform 23, 3299–3304 (2014). https://doi.org/10.1007/s11665-014-1120-7

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  • DOI: https://doi.org/10.1007/s11665-014-1120-7

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