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Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

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Abstract

Au-Ge-based solder alloys are promising alternatives to lead containing solders due to the fact that they offer a combination of interesting properties such as good thermal and electrical conductivity and high corrosion resistance in addition to a relatively low melting temperature (361 °C for eutectic Au-28Ge at.%). By adding a third element to the eutectic Au-28Ge alloy not only the Au content could be reduced but also the melting temperatures could be further decreased. In this study, in addition to the eutectic Au-28Ge (at.%) two ternary alloys were chosen from the Au-Ge-Sb and Au-Ge-Sn system, respectively. The soldering behavior of these alloys in combination with the frequently used metals Cu, Ni, and Ti was investigated. The interface reactions and microstructures of the joints were characterized in detail by SEM and EDX analysis. For the determination of the mechanical properties, shear tests were conducted. Mean shear strength values up to 104 MPa could be achieved.

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Acknowledgments

The authors thank the Laboratory of Metal Physics and Technology, Department of Materials, ETH Zürich for providing support with melt spinning.

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Author notes

  1. Shan Jin

    Present address: Thermo-Calc Software, Stockholm, Sweden

  2. Liliana I. Duarte

    Present address: ABB, Baden-Dättwil, Switzerland

Authors and Affiliations

  1. Laboratory for Joining Technologies and Corrosion, Empa – Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland

    Nico Weyrich, Shan Jin, Liliana I. Duarte & Christian Leinenbach

Authors
  1. Nico Weyrich
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  2. Shan Jin
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  3. Liliana I. Duarte
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  4. Christian Leinenbach
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Corresponding author

Correspondence to Nico Weyrich.

Additional information

This article is an invited submission to JMEP selected from presentations at the Symposia “Wetting,” “Interface Design,” and “Joining Technologies” belonging to the Topic “Joining and Interface Design” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2013), held September 8-13, 2013, in Sevilla, Spain, and has been expanded from the original presentation.

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Weyrich, N., Jin, S., Duarte, L.I. et al. Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys. J. of Materi Eng and Perform 23, 1585–1592 (2014). https://doi.org/10.1007/s11665-014-0864-4

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  • DOI: https://doi.org/10.1007/s11665-014-0864-4

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