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Mechanical Properties of Ternary Sn-In-Ag Ball-Grid Array Assemblies at Ambient and Elevated Temperatures

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Abstract

The mechanical behavior of a ternary Sn-15In-2.8Ag ball-grid array assembly was evaluated at ambient and elevated temperatures. The maximum stress of the Sn-15In-2.8Ag ball-grid array assembly decreased as the temperatures increased and the strain rates decreased. An irregular brittle NiSnIn intermetallic layer formed at the SnInAg/Au/Ni/Cu interface, resulting in decreased bond strength of the joints. The Arrhenius diagram of the Sn-15In-2.8Ag ball-grid array assembly at a constant stress of 16 MPa consists of two straight lines intersecting at 50 °C, which indicates that two kinds of creep mechanism controlled the Sn-15In-2.8Ag ball-grid array assembly deformation. The AuIn2 intermetallics and grain boundaries acted as the location for nucleation of the creep voids, which induced reduction of the solder’s cross-sectional area and led the Sn-15In-2.8Ag ball-grid array assembly to fail rapidly with a transgranular creep fracture.

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Acknowledgment

The authors would like to acknowledge the financial support of this work from the National Science Council of the Republic of China under grant no. NSC 91-2216-E-216-002.

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  1. Department of Mechanical Engineering, Chung Hua University, 707, Sec. 2, Wu Fu Rd., Hsin Chu, 300, Taiwan, ROC

    M. S. Yeh & J. T. Chiang

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  1. M. S. Yeh
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  2. J. T. Chiang
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Correspondence to M. S. Yeh.

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Yeh, M.S., Chiang, J.T. Mechanical Properties of Ternary Sn-In-Ag Ball-Grid Array Assemblies at Ambient and Elevated Temperatures. J. of Materi Eng and Perform 18, 1073–1077 (2009). https://doi.org/10.1007/s11665-008-9337-y

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  • DOI: https://doi.org/10.1007/s11665-008-9337-y

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