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Precipitation Hardening of Cu-3Ti-1Cd Alloy

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Precipitation strengthening of Cu-3Ti-1Cd alloy has been studied using hardness and tensile tests, electrical resistivity measurements, and transmission electron microscopy. The alloy exhibited a hardness of 117 Hv in solution-treated (ST) condition and attained a peak hardness of 288 Hv after aging at 450 °C for 72 h. Electrical conductivity increased from 7%IACS (International Annealed Copper Standard) in ST condition to 13%IACS on aging at 450 °C for 16 h. The alloy exhibited yield strength (YS) of 643 MPa and ultimate tensile strength (UTS) of 785 MPa in peak-aged (PA) condition. Strengthening in Cu-3Ti-1Cd alloy in PA condition is attributed to solid solution strengthening effect of cadmium (Cd) as well as fine scale precipitation of metastable and coherent β′-Cu4Ti phase. On overaging at 450 or 500 °C, the alloy showed a decrease in hardness as a result of formation of equilibrium precipitate β-Cu3Ti as continuous precipitation within the matrix and as discontinuous precipitation at the grain boundaries. While the tensile properties are better, the electrical conductivity of Cu-3Ti-1Cd alloy is less than that of binary Cu-2.7Ti alloy. The strengthening mechanism is the same in both binary and ternary alloys of Cu-Ti, i.e., precipitation of metastable and coherent β′-Cu4Ti phase.

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Acknowledgments

The authors gratefully acknowledge Head, Department of Metallurgical Engineering, ITBHU, Varanasi, for providing laboratory facilities. The authors are thankful to Defence Research and Development Organization, New Delhi for financial support. The authors thank Director, Defence Metallurgical Research Laboratory, Hyderabad for permission to publish this work. One of the authors (RM) is thankful to Jawaharlal Nehru Technological University, Hyderabad for granting leave under QIP.

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Markandeya, R., Nagarjuna, S. & Sarma, D. Precipitation Hardening of Cu-3Ti-1Cd Alloy. J. of Materi Eng and Perform 16, 640–646 (2007). https://doi.org/10.1007/s11665-007-9082-7

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  • DOI: https://doi.org/10.1007/s11665-007-9082-7

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