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Evaluation on the characteristics of tin-silver-bismuth solder

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Abstract

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210°–212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Beijing Polytechnic University, 100 Ping Le Yuan, Chaoyang Dist., 100022, Beijing, China

    Z. Xia, Y. Shi & Z. Chen

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  1. Z. Xia
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  2. Y. Shi
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  3. Z. Chen
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Xia, Z., Shi, Y. & Chen, Z. Evaluation on the characteristics of tin-silver-bismuth solder. J. of Materi Eng and Perform 11, 107–111 (2002). https://doi.org/10.1007/s11665-002-0016-0

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  • DOI: https://doi.org/10.1007/s11665-002-0016-0

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