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The microstructures of the Sn-Zn-Al solder alloys

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Abstract

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders investigated were 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China

    Kwang-Lung Lin, Li-Hsiang Wen & Tzy-Pin Liu

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  1. Kwang-Lung Lin
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  2. Li-Hsiang Wen
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  3. Tzy-Pin Liu
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Lin, KL., Wen, LH. & Liu, TP. The microstructures of the Sn-Zn-Al solder alloys. J. Electron. Mater. 27, 97–105 (1998). https://doi.org/10.1007/s11664-998-0197-x

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  • DOI: https://doi.org/10.1007/s11664-998-0197-x

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