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Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach

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Abstract

Rapid and accurate reliability assessment of electronic devices is a key issue in device design. In this work, a machine learning algorithm was developed to estimate the fatigue lifetime of ball grid solder joints under thermomechanical loading cycles. Using this novel approach, an extremely quick estimation of the thermomechanical fatigue lifetime of the ball grid solder joints was achieved. Several finite element simulations were performed to investigate the creep behavior of the solder joints under different thermal loading conditions. The collected data were then inserted into the proposed machine learning algorithm. The results demonstrated that the model can accurately predict the lifetime of the ball grid solder joints in the shortest possible time. It was also revealed that thermal cycling specifications play a crucial role in interconnection failure. The effects of the solder chemical composition and the volume on the activation of the fatigue and creep damage in the solder joints were determined, which make this novel approach attractive for reliability assessment in the preliminary stage of system design.

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Authors and Affiliations

  1. Department of Industrial Engineering and Management, Ming Chi University of Technology, New Taipei City, 24301, Taiwan

    Tzu-Chia Chen

  2. College of Business Administration, Ajman University, Ajman, United Arab Emirates

    Maria Jade Catalan Opulencia

  3. Al-Mustaqbal University College, Hilla, Iraq

    Hasan Sh. Majdi

  4. Computer Engineering Techniques Department, Faculty of Information Technology, Imam Ja’afar Al-Sadiq University, Baghdad, Iraq

    Ali Thaeer Hammid

  5. Department of Computer Engineering and Applications, GLA University, Mathura, India

    Himanshu Sharma

  6. Department of Chemistry, Payame Noor University, PO BOX 19395-4697, Tehran, Iran

    Sami Sajjadifar

  7. Saveetha Institute of Medical and Technical Sciences, Chennai, India

    Aravindhan Surendar

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  1. Tzu-Chia Chen
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Chen, TC., Opulencia, M.J.C., Majdi, H.S. et al. Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach. J. Electron. Mater. 51, 3495–3503 (2022). https://doi.org/10.1007/s11664-022-09635-2

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  • DOI: https://doi.org/10.1007/s11664-022-09635-2

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