Abstract
Thermoelectric materials carry significant promise for self-powering future generations of unattended microdevices and wearable devices. The current increased interest in such devices highlights the need for research to provide understanding of the basic material properties of thermoelectric materials, specifically in thin-film form, deposited on flexible polymer substrates. In this study, the surface topography, crystalline structure, and electrical properties of sputtered thin films of two of the most common thermoelectric materials, i.e., antimony telluride (Sb2Te3) and bismuth telluride (Bi2Te3), supported on silicon and polymer substrates were investigated. The study focuses on determining the effect of the sputtering power and underlying substrate on the crystal structure formation as well as grain size of the resulting thin film. Radiofrequency (RF) magnetron sputtering with power levels from 50 W to 200 W was used to deposit these layers on several test structures. The results demonstrate that increasing the RF sputtering power resulted in (i) an increase in the crystalline size (from 0.48 nm to 29.66 nm for Sb2Te3 and from 10.60 nm to 20.29 nm for Bi2Te3), (ii) a significant increase in the content of tellurium (Te) in the Sb2Te3 and Bi2Te3 thin films, (iii) an order-of-magnitude increase in the electrical conductivity of the Bi2Te3 thin film fabricated on silicon wafer, and (iv) a 150% increase in the Seebeck coefficient for both Bi2Te3 and Sb2Te3 samples. Furthermore, surface roughness analysis showed that deposition on polyimide substrate modestly increased the surface roughness (Ra), from 6.59 nm to 9.91 nm for Bi2Te3 and from 12.46 nm to 15.41 nm for Sb2Te3. The electrical resistivity of Bi2Te3 thin films on polyimide was found to be 2.72 × 10−3 Ω m, compared with 1.58 × 10−3 Ω m on silicon substrate, while for Sb2Te3,, the electrical resistivity on polyimide substrate increased to 580 × 10−3 Ω m as compared with 145 × 10−3 Ω m on silicon substrate. Taken together, the results of this work demonstrate that the use of high deposition power during RF sputtering of Sb2Te3 and Bi2Te3 thin films results in significant improvements in their crystallinity, conductivity, and Seebeck coefficient, which are key material properties of great importance for thermoelectric materials.
Similar content being viewed by others
References
L.E. Bell, Science 321, 1457 (2008).
D. Champier, Energy Convers. Manag. 140, 167 (2017).
S.B. Riffat, and X. Ma, Appl. Therm. Eng. 23, 913 (2003).
C.S. Kim, H.M. Yang, J. Lee, G.S. Lee, H. Choi, Y.J. Kim, S.H. Lim, S.H. Cho, and B.J. Cho, ACS Energy Lett. 3, 501 (2018).
Y. Lee, D. Blaauw, and D. Sylvester, Proc. IEEE 104, 1529 (2016).
Y. Liao, H. Yao, A. Lingley, B. Parviz, and B.P. Otis, IEEE J. Solid-State Circuits 47, 335 (2012).
D.P. Rose, M.E. Ratterman, D.K. Griffin, L. Hou, N. Kelley-Loughnane, R.R. Naik, J.A. Hagen, I. Papautsky, and J.C. Heikenfeld, IEEE Trans. Biomed. Eng. 62, 1457 (2014).
D.M. Rowe, Renew. Energy 16, 1251 (1999).
K. Singkaselit, A. Sakulkalavek, and R. Sakdanuphab, Adv. Nat. Sci. Nanosci. Nanotechnol. 8, 035002 (2017).
J.-H. Kim, J.-Y. Choi, J.-M. Bae, M.-Y. Kim, and T.-S. Oh, Mater. Trans. 54, 618 (2013).
F. Yang, S. Zheng, H. Wang, W. Chu, and Y. Dong, J. Micromech. Microeng. 27, 055005 (2017).
A. Al-Bayaz, A. Giani, M. Artaud, A. Foucaran, F. Pascal-Delannoy, and A. Boyer, J. Cryst. Growth 241, 463 (2002).
C. W. Lee, G. H. Kim, J. W. Choi, K. S. An, J. S. Kim, H. Kim, and Y. K. Lee, Physica Status Solidi (RRL)–Rapid Res. Lett. 11, 1700029 (2017).
S. Golia, M. Arora, R. Sharma, and A. Rastogi, Curr. Appl. Phys. 3, 195 (2003).
P. Fourmont, L.F. Gerlein, F.-X. Fortier, S.G. Cloutier, and R. Nechache, ACS Appl. Mater. Interfaces 10, 10194 (2018).
Z. Cao, M.J. Tudor, R.N. Torah, and S.P. Beeby, IEEE Trans. Electron Devices 63, 4024 (2016).
H. Huang, W.-L. Luan, and S.-T. Tu, Thin Solid Films 517, 3731 (2009).
P. Nuthongkum, R. Sakdanuphab, M. Horprathum, and A. Sakulkalavek, J. Electron. Mater. 46, 6444 (2017).
S. Shen, W. Zhu, Y. Deng, H. Zhao, Y. Peng, and C. Wang, Appl. Surf. Sci. 414, 197 (2017).
D.-H. Kim, E. Byon, G.-H. Lee, and S. Cho, Thin Solid Films 510, 148 (2006).
D.-H. Kim and G.-H. Lee, Mater. Sci. Eng. B 131, 106 (2006).
S. Nimbalkar, E. Castagnola, A. Balasubramani, A. Scarpellini, S. Samejima, A. Khorasani, A. Boissenin, S. Thongpang, C. Moritz, and S. Kassegne, Sci. Rep. 8, 6958 (2018).
S.W. Shaner, J.K. Allen, M. Felderman, E.T. Pasko, C.D. Wimer, N.D. Cosford, S. Kassegne, and P. Teriete, AIP Adv. 9, 065313 (2019).
V. Russo, A. Bailini, M. Zamboni, M. Passoni, C. Conti, C.S. Casari, A. Li Bassi, and C.E. Bottani, J. Raman Spectrosc. 39, 205 (2008).
B.-Y. Chang and S.-M. Park, Annu. Rev. Anal. Chem. 3, 207 (2010).
N. Hatsuta, D. Takemori, and M. Takashiri, J. Alloys Compd. 685, 147 (2016).
J.-M. Lin, Y.-C. Chen, and W. Chen, J. Nanomater. 16, 225 (2015).
J.-M. Lin, Y.-C. Chen, and C.-P. Lin, J. Nanomater. 2013, 1 (2013).
E.M.F. Vieira, J. Figueira, A.L. Pires, J. Grilo, M.F. Silva, A.M. Pereira, and L.M. Goncalves, J. Alloys Compd. 774, 1102 (2019).
M. Goto, M. Sasaki, Y. Xu, T. Zhan, Y. Isoda, and Y. Shinohara, Appl. Surf. Sci. 407, 405 (2017).
Y.-J. Wu, S.-C. Hsu, Y.-C. Lin, Y. Xu, T.-H. Chuang, and S.-C. Chen, Surf. Coat. Technol., 125694 (2020).
S. Cho, Y. Kim, A. DiVenere, G.K. Wong, J.B. Ketterson, and J.R. Meyer, Appl. Phys. Lett. 75, 1401 (1999).
Z.-K. Cai, P. Fan, Z.-H. Zheng, P.-J. Liu, T.-B. Chen, X.-M. Cai, J.-T. Luo, G.-X. Liang, and D.-P. Zhang, Appl. Surf. Sci. 280, 225 (2013).
S.R. Sridhara, M. DiRenzo, S. Lingam, S.-J. Lee, R. Blazquez, J. Maxey, S. Ghanem, Y.-H. Lee, R. Abdallah, and P. Singh, IEEE J. Solid-State Circuits 46, 721 (2011).
S. Jo, M. Kim, M. Kim, and Y.-J. Kim, Electron. Lett. 48, 1015 (2012).
Acknowledgments
This material is based on research work supported by the Center for Neurotechnology (CNT), a National Science Foundation Engineering Research Center (EEC-1028725).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of Interest
On behalf of all the authors, the corresponding author states that there are no conflicts of interest.
Additional information
Publisher’s Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Supplementary Information
Below is the link to the electronic supplementary material:
Rights and permissions
About this article
Cite this article
Amirghasemi, F., Kassegne, S. Effects of RF Magnetron Sputtering Deposition Power on Crystallinity and Thermoelectric Properties of Antimony Telluride and Bismuth Telluride Thin Films on Flexible Substrates. J. Electron. Mater. 50, 2190–2198 (2021). https://doi.org/10.1007/s11664-020-08681-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-020-08681-y