Abstract
Bismuth (Bi) is an alloying element being considered for inclusion in lead-free solder alloys to improve microstructure, properties, and reliability. It has been determined that aging a Bi-bearing alloy will preserve its strength, whereas the strength of SAC alloys is degraded. Examination of microstructure reveals that, over time, homogenization of Bi in the tin (Sn) matrix via solid-state diffusion occurs, which leads to stabilization of mechanical properties. In this study, the effect of Sn grain orientation on the diffusivity of Bi was analyzed. Sn was solidified slowly to produce coarse grains typical of grain morphologies in solder joints. Bi was subsequently sputtered onto the Sn, and samples underwent annealing at 125°C for 24 h. Electron probe microanalysis (EPMA) was utilized to collect compositional data, and diffusivities were extracted for several grain orientations. It was determined that the diffusivity of Bi in Sn has a low anisotropy ratio, with a difference in diffusivity of around an order of magnitude between Sn samples oriented with the concentration gradient perpendicular to the ‘c’ axis and those oriented parallel to the ‘c’ axis. As a result, low angle grain boundaries in the Sn samples can have a profound effect on the diffusivity and confound the orientation relationship.
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H. Ma, J. Suhling, Y. Zhang, P. Lall, and M.J. Bozack, in Electronic Components and Technology Conference Proceedings (2007) pp. 653–658.
M. Hasnine, M. Mustafa, J.C. Suhling, B.C. Prorok, M.J. Bozack, and P. Lall, in 2013 Electronic Components and Technology Conference Proceedings (2013) pp. 168–178.
P. Snugovsky, S. Bagheri, M. Romansky, D. Perovic, L. Snugovsky, and J. Rutter, J. Electron. Mater. 25, 2 (2012).
David Witkin, in APEX Expo Proceedings (2013), pp. 540–560.
J. Juarez, P. Snugovsky, E. Kosiba, Z. Bagheri, S. Subramaniam, M. Robinson, J. Heebink, J. Kennedy, and M. Romansky, J. Microelectron. Electron. Packag. 12, 1 (2015).
P. Vianco and J.A. Rejent, J. Electron. Mater. 28, 10 (1999).
A. Delhaise, L. Snugovsky, D. Perovic, P. Snugovsky, and E. Kosiba, J. Surf. Mt. Technol. 27, 3 (2014).
A. Delhaise and D. Perovic, J. Electron. Mater. 47, 3 (2018).
F. Sauer and V. Friese, VZ Elektrochem. 66, 353 (1962).
L.D. Hall, J. Chem. Phys. 21, 87 (1953).
A. Delhaise, P. Snugovsky, I. Matijevic, J. Kennedy, M. Romansky, D. Hillman, D. Adams, S. Meschter, J. Juarez, M. Kammer, I. Straznicky, L. Snugovsky, and D. Perovic, J. Surf. Mt. Technol. 31, 1 (2018).
K. Seshan, Handbook of Thin Film Deposition—Processes and Technologies, 2nd ed. (New York: Noyes Publications, 2002), pp. 14–28.
M.P. Seah, Thin Solid Films 81, 3 (1981).
T.-K. Lee, T. Bieler, C.-U. Kim, and H. Ma, Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability, 1st ed. (New York: Springer, 2015), p. 77.
F.H. Huang and H.B. Huntington, Phys. Rev. B. 19, 4 (1974).
B.F. Dyson, T.R. Anthony, and D. Turnbull, J. Appl. Phys. 38, 8 (1967).
D.C. Yeh and H.B. Huntington, Phys. Rev. Lett. 53, 15 (1984).
R. Coyle, R. Aspandiar, M. Osterman, C. Johnson, R. Popowich, R. Parker, and D. Hillman, in 2017 SMTA International Conference Proceedings (2017) pp. 72–83.
C. Soong, P. Woo, and D. Hoyle, Microsc. Today 20, 6 (2012).
WinWULFF (Stereogram, Stereographic Projection, Wulff-net, Simulation Software) (JCrystal). http://jcrystal.com/products/winwulff/. Accessed 12 June 2017.
Q. Zhang and J. Zhao, Intermetallics 34, 132 (2013).
L. Zhu, Q. Zhang, Z. Chen, C. Wei, G. Cai, L. Jiang, Z. Jin, and J. Zhao, J. Mater. Sci. 52, 6 (2016).
Q. Zhang, Z. Chen, W. Zhong, and J. Zhao, Scr. Mater. 128 (2017).
pyDiffusion, a Python library for diffusion simulation and data analysis (Zhangqi Chen). https://github.com/zhangqi-chen/pyDiffusion. Accessed 21 Feb 2018.
W. Seith, J. Elektrochem. 39, 538 (1933).
S. Belyakov and C. Gourlay, Thermochem. Acta. 654 (2017).
B.-J. Lee, C.-S. Oh, and J.-H. Shim, J. Electron. Mater. 25, 6 (1996).
J. Vizdal, M.H. Braga, A. Kroupa, K.W. Richter, D. Soares, L.F. Malheiros, and J. Ferreira, Comput. Coupling Phase Diagr. Thermochem. 31, 4 (2007).
M.H. Braga, J. Vizdal, A. Kroupa, J. Ferreira, D. Soares, and L.F. Melheiros, Comput. Coupling Phase Diagr. Thermochem. 31, 4 (2007)
P. Shewmon, Diffusion in Solids, 2nd ed. (Warrendale: The Minerals, Metals & Materials Society, 1989), pp. 42–46.
H. Mehrer, Diffusion in Solids—Fundamentals, Methods, Materials, Diffusion-Controlled Processes, 1st ed. (New York: Springer, 2007), pp. 168–169.
H. Mehrer, Diffusion in Solids—Fundamentals, Methods, Materials, Diffusion-Controlled Processes, 1st ed. (New York: Springer, 2007), p. 98.
P. Shewmon, Diffusion in Solids, 2nd ed. (Warrendale: The Minerals, Metals & Materials Society, 1989), pp. 142–145.
F.J. Humphreys and M. Hatherly, Recrystallization and Related Annealing Phenomena, 2nd ed. (Oxford: Elsevier, 2004), pp. 293–303.
M.R. Spiegel, Schaum’s Outline of Theory and Problems of Vector Analysis and an Introduction to Tensor Analysis (New York: McGraw-Hill, 1959), p. 16.
D.A. Porter and K.E. Easterling, Phase Transformations in Metals and Alloys, 2nd ed. (London: Chapman & Hall, 1992), pp. 263–279.
D.A. Porter and K.E. Easterling, Phase Transformations in Metals and Alloys, 2nd ed. (London: Chapman & Hall, 1992), pp. 98–102.
S.-W. Chen, C.-C. Chen, W. Gierlotka, A.-R. Zi, P.-Y. Chen, and H.-J. Wu, J. Electron. Mater. 37, 7 (2008).
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Delhaise, A.M., Chen, Z. & Perovic, D.D. Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation. J. Electron. Mater. 48, 32–43 (2019). https://doi.org/10.1007/s11664-018-6621-y
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DOI: https://doi.org/10.1007/s11664-018-6621-y