TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this topical collection (19 articles)

  1. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

    Chao Huang, Li Rao, Menglong Sun, Anmin Hu, Ming Li Pages 1-8
  2. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints

    T. H. Yang, H. Y. Yu, Y. W. Wang, C. R. Kao Pages 9-16
  3. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications

    Y. W. Wang, W. L. Shih, H. T. Hung, C. R. Kao Pages 25-31
  4. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

    André M. Delhaise, Zhangqi Chen, Doug D. Perovic Pages 32-43
  5. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material

    Chun-Hsien Wang, Hsien-Chien Hsieh, Hsin-Yi Lee Pages 53-57
  6. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation

    Irene Lujan-Regalado, Antony Kirubanandham Pages 58-71
  7. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Room Temperature Bonding on Interface Between Metal and Ceramic

    Kyu-Bong Jang, Sungwook Mhin, Sung-Chul Lim Pages 72-78
  8. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Facile Design of Conductive Ag-PDMS Electrodes for Stretchable Electrodes

    Kyoung Ryeol Park, Jae Eun Jeon, Hyuksu Han, Sehoon Yoo Pages 79-84
  9. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    The Potential for Metal–Carbon Nanotubes Composites as Interconnects

    Leila Ladani Pages 92-98
  10. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

    Che-Wei Chang, Kwang-Lung Lin Pages 135-141
  11. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment

    Xuewei Zhao, Limin Ma, Yishu Wang, Fu Guo Pages 152-158
  12. No Access

    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias

    Hanry Yang, Tae-Kyu Lee, Lutz Meinshausen Pages 159-169