Abstract
Polycrystalline Cu3BiS3 was synthesized and densified using hot pressing in order to investigate the physical properties of this material. Both the thermal conductivity and the Seebeck coefficient of Cu3BiS3 are reported for the first time in order to investigate the thermoelectric properties of this material. The ultralow thermal conductivity coupled with the relatively high Seebeck coefficient, 0.17 W/m-K and 540 μV/K at room temperature, respectively, suggest Cu3BiS3 may show promise for thermoelectric applications.
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Wei, K., Hobbis, D., Wang, H. et al. Wittichenite Cu3BiS3: Synthesis and Physical Properties. J. Electron. Mater. 47, 2374–2377 (2018). https://doi.org/10.1007/s11664-017-6053-0
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DOI: https://doi.org/10.1007/s11664-017-6053-0