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Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

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Abstract

We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm2 is ∼7 times higher and the mean three-dimensional length of rods is ∼4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on δ-Cu33Al17 or γ 1-Cu9Al4 particles, which are stable␣in the Sn-0.7Cu-0.05Al melt during holding at 250°C. The observed facet relationships agree well with previously determined orientation relationships between δ-Cu33Al17 and Cu6Sn5 in hypereutectic Sn-Cu-Al alloys and result in a good lattice match with <∼2.5% lattice mismatch on two different interfacial planes.

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Acknowledgements

We are grateful for support from Nihon Superior Co., Ltd. and UK EPSRC Grant EP/M002241/1.

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Authors and Affiliations

  1. Department of Materials, Imperial College, London, SW7 2AZ, UK

    J. W. Xian, S. A. Belyakov & C. M. Gourlay

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  1. J. W. Xian
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  2. S. A. Belyakov
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  3. C. M. Gourlay
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Correspondence to J. W. Xian.

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Xian, J.W., Belyakov, S.A. & Gourlay, C.M. Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying. J. Electron. Mater. 45, 69–78 (2016). https://doi.org/10.1007/s11664-015-4092-y

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  • DOI: https://doi.org/10.1007/s11664-015-4092-y

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