Abstract
Photosensitive polyimide (PSPI) based insulating layer fabrication for microelectromechanical systems (MEMS) application has been systematically investigated in this work. The PSPI was spin coated on a silicon substrate as an insulating layer between two metal lines. In consideration of thermal properties, a low temperature hard bake process was carefully optimized. Finally, the polyimide insulating layer was hardened by exposure to air at 80°C for 120 min + 150°C for 60 min + 180°C for 60 min + 250°C for 60 min + 350°C for 60 min in a dry furnace. Using this optimized hardening process, the outgassing effect in post-fabrication heat treatment can be completely eliminated, which presented an excellent thermal resistance in MEMS fabrications. The reliability test was accomplished through an immersion in organic solvent and acid/base solution in order to verify the corrosion resistance of the PSPI frame for insulating application. The excellent resistance which is on the order of 108 Ω between two metal lines, shows an outstanding insulating property.
Similar content being viewed by others
References
T.L. Alford, Y.L. Zou, K.S. Gadre, C. King, W. Chen, and D.N. Theodore, J. Vac. Sci. Technol. B 19, 774 (2001).
X.Z. Jin and H. Ishii, J. Appl. Polym. Sci. 98, 15 (2005).
J.S. Jiang and B.S. Chiou, J. Mater. Sci. 12, 655 (2001).
M.E. Grady, P.H. Geubelle, and N.R. Sottos, Thin Solid Films 552, 116 (2014).
N. Yodo, Polym. Adv. Technol. 8, 215 (1997).
S.G.J. Coulm, D. Leonard, and F. Bessueille, Appl. Surf. Sci. 307, 716 (2014).
Y.X. Kato, S. Furukawa, K. Samejima, N. Hironaka, and M. Kashino, Front. Neuroeng. 5, 11 (2012).
X. Zhou, L. Che, J. Wu, X. Li, and Y. Wang, J. Micromech. Microeng. 22, 085031 (2012).
L. Peng, L. Zhang, J. Fan, H.Y. Li, D.F. Lim, and C.S. Tan, I.E.E.E. Electr. Device. L. 33, 1747 (2012).
W.W. Flack, G.E. Flores, and L. Christensen, G. Newman (1996). doi:10.1117/12.240970.
T. Higashihara, Y. Shibasaki, and M. Ueda, J. Photopolym. Sci. Technol. 25, 9 (2012).
A. Mochizuki and M. Ueda, J. Photopolym. Sci. Technol. 14, 677 (2001).
K.I. Fukuka and M. Ueda, Polym. J. 40, 281 (2008).
J. Fan, D.F. Lim, and C.S. Tan, J. Micromech. Microeng. 23, 045025 (2013).
J. Fan, L. Peng, K.H. Li, and C.S. Tan, J. Micromech. Microeng. 22, 105004 (2012).
J. Fan, P. Anantha, C.Y. Liu, M. Bergkvist, H. Wang, and C.S. Tan, ECS J. Solid State Sci. Technol. 2, N169 (2013).
J. Fan, G.Y. Chong, and C.S. Tan, ECS J. Solid State Sci. Technol. 1, P291 (2012).
C.T. Ko and K.N. Chen, Microelectron. Reliab. 50, 481 (2010).
J. Wei, H. Xie, M.L. Nai, C.K. Wong, and L.C. Lee, J. Micromech. Microeng. 13, 217 (2003).
C.S. Tan, D.F. Lim, S.G. Singh, S.K. Goulet, and M. Bergkvist, Appl. Phys. Lett. 95, 192108 (2009).
W.J. Wu, T. Zhu, J.Q. Liu, J. Fan, and L.C. Tu, J. Electron. Mater. 44, 991 (2015).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Fan, J., Zhu, T., Wu, W.J. et al. Low Temperature Photosensitive Polyimide Based Insulating Layer Formation for Microelectromechanical Systems Applications. J. Electron. Mater. 44, 4891–4897 (2015). https://doi.org/10.1007/s11664-015-4076-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-015-4076-y