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Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization

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Authors and Affiliations

  1. the Institute of Materials Research and Engineering, 3 Research Link, 117602, Singapore

    K. Y. Lee (Research Officer) & M. Li (Research Fellow)

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  1. K. Y. Lee
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  2. M. Li
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Lee, K.Y., Li, M. Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization. Metall Mater Trans A 32, 2666–2668 (2001). https://doi.org/10.1007/s11661-001-0058-1

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  • DOI: https://doi.org/10.1007/s11661-001-0058-1

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