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Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders

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Abstract

The effect of electromigration (EM) on Sn(Cu)/Ni/Cu solder joint interfaces under current stressing of 104 A/cm2 at 160°C was studied. In the pure Sn/Ni/Cu case, the interfacial compound layer was mainly the Cu6Sn5 compound phase, which suffered serious EM-induced dissolution, eventually resulting in serious Cu-pad consumption. In the Sn-0.7Cu case, a (Cu,Ni)6Sn5 interfacial compound layer formed at the joint interface, which showed a strong resistance to EM-induced dissolution. Thus, there was no serious consumption of the Cu pad under current stressing. In the Sn-3.0Cu case, we believe that the␣massive Cu6Sn5 phase in the solder matrix eased possible EM-induced dissolution at the interfacial compound layer due to current stressing.

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-Li, Taiwan

    Y. H. Hsiao, H. W. Tseng & C. Y. Liu

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  1. Y. H. Hsiao
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  2. H. W. Tseng
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  3. C. Y. Liu
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Correspondence to Y. H. Hsiao.

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Hsiao, Y.H., Tseng, H.W. & Liu, C.Y. Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders. J. Electron. Mater. 38, 2573–2578 (2009). https://doi.org/10.1007/s11664-009-0914-0

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  • DOI: https://doi.org/10.1007/s11664-009-0914-0

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