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Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth

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Intermetallic growth and ball shear behavior of annealed Cu wire bonds on Al have been studied. The shear strength of Cu ball bonds decreased with time, and ductile fracture was the dominant failure mode from 125°C to 150°C. Al pad peel-off occurred as the aging temperature was increased above 150°C. The overall Cu/Al intermetallic thickness exhibited parabolic behavior as a function of time. A linear correlation was established between ball shear strength, metal peel-off occurrence, and intermetallic growth. The Cu/Al intermetallic growth activation energy was 0.23 eV, and the intermetallics identified in the experiment were CuAl2 and CuAl.

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Authors and Affiliations

  1. Department of Mining, Metallurgy, and Materials Engineering, University of the Philippines, Diliman, Quezon City, Philippines

    Jose Omar S. Amistoso & Alberto V. Amorsolo Jr.

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  1. Jose Omar S. Amistoso
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  2. Alberto V. Amorsolo Jr.
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Correspondence to Jose Omar S. Amistoso.

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Amistoso, J.O.S., Amorsolo, A.V. Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth. J. Electron. Mater. 39, 2324–2331 (2010). https://doi.org/10.1007/s11664-010-1320-3

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  • DOI: https://doi.org/10.1007/s11664-010-1320-3

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