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Effect of Temperature and Stress on Hot Impression Creep Behavior of Cu-1.5 Zn Alloy

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Abstract

Cu-1.5 wt.% Zn alloy used in the present study was subjected to the hot impression creep tests at three stresses of 75, 110 and 150 MPa and three temperatures of 250, 300 and 350 °C for a constant dwell time of 2 h. The effect of stress and temperature on the impression depth with respect to time was studied. Irrespective of the test condition, the depth of impression increased with respect to the time. However, upon increasing the applied stress, the twins were observed. Stress exponent values and activation energies were determined for different test temperatures and stresses. Stress exponent values related to the plastic flow over the complete range of experimental conditions were found to lie between 4 and 5.5. Whereas the average activation energy value was determined to be 164 ± 10 kJ/mol. Calculated stress exponents and activation energy values reveal the dislocation climb phenomenon, controlled by dislocation pipe diffusion as the mechanism of the creep.

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Acknowledgment

The authors thank the administration of NIT Warangal for providing research facilities to carry out this research work.

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  1. Department of Metallurgical and Materials Engineering, National Institute of Technology Warangal, Hanamkonda, Telangana, India

    C. Vanitha, Baro Kaushik & C. Sashank

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This article is an invited submission to the Journal of Materials Engineering and Performance selected from presentations at the 4th International Conference on Processing & Characterization of Materials (ICPCM 2022) held December 9–11, 2022, at the National Institute of Technology, Rourkela, Odisha, India. It has been expanded from the original presentation. The issue was organized by Prof. Joao Pedro Oliveira, Universidade NOVA de Lisboa, Portugal; Prof. B. Venkata Manoj Kumar, Indian Institute of Technology Roorkee, India; Dr. D. Arvindha Babu, DMRL, DRDO, Hyderabad, India; Prof. Kumud Kant Mehta and Prof. Anshuman Patra, National Institute of Technology Rourkela, Odisha, India; and Prof. Manab Mallik, National Institute of Technology Durgapur, India.

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Vanitha, C., Kaushik, B. & Sashank, C. Effect of Temperature and Stress on Hot Impression Creep Behavior of Cu-1.5 Zn Alloy. J. of Materi Eng and Perform (2023). https://doi.org/10.1007/s11665-023-08567-0

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