Abstract
This paper presents experimental results and theoretical calculations that evaluate the effects of Bi contamination on the solidification behavior of Sn-Pb alloys. The pasty (mushy) range, the type of solidification path, and the microstructure of the solidified alloys are described. The experimental results are obtained from thermal analysis and metallography, and the solidification calculations are performed using the lever rule and Scheil assumptions. The experimental results show that the solidification behavior of the contaminated solder at cooling rates of 5°C/min and 23°C/min is closer to the predictions of the lever rule calculations than those of the Scheil calculations. Although the freezing range of Bi-contaminated Sn-Pb solders is increased, formation of a ternary eutectic reaction at 95°C is not observed for contamination levels below the Bi mass fraction of 6%.
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The authors thank W.J. Boettinger, NIST, for many helpful discussions.
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Moon, KW., Kattner, U.R. & Handwerker, C.A. The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders. J. Electron. Mater. 36, 676–681 (2007). https://doi.org/10.1007/s11664-007-0117-5
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DOI: https://doi.org/10.1007/s11664-007-0117-5