Abstract
Zn-based alloys have been investigated to replace Pb-5%Sn solder for die-attaching use. We have found that a Zn-4%Al-3%Mg-3%Ga alloy has a 309°C solidus and a 347°C liquidus. A die-attaching test was done with preforms of this alloy, Ag-plated lead-frames, and Au-plated dummy dies. Good die-attaching with a small amount of voids can be achieved at 320°C or higher. In subsequent reliability tests, no failure was observed until 1000 cycles between −65°C and 150°C or until 1000 h at 85°C and 85% humidity. Although the poor workability and poor ability of stress relaxation at room temperature of this alloy may somewhat limit its application areas, this solder is the first Pb-free solder for die-attaching use to our knowledge.
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Shimizu, T., Ishikawa, H., Ohnuma, I. et al. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use. J. Electron. Mater. 28, 1172–1175 (1999). https://doi.org/10.1007/s11664-999-0153-4
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DOI: https://doi.org/10.1007/s11664-999-0153-4