Skip to main content
SpringerLink
Log in

Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications

  • Published:
Metallurgical and Materials Transactions A Aims and scope Submit manuscript

Abstract

Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE=4 to 6.5 ppm/K) and thermal conductivities (k≥260 W/m K).

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Metals Handbook, 9th ed., ASM, Materials Park, OH, vol. 3, 1980.

  2. C.Z. Zweben: J. Met., 1992, vol. 44 (7), pp. 15–23.

    CAS  Google Scholar 

  3. M.K. Premkumar, W.H. Hunt, Jr., and R.R. Sawtell: J. Met., 1992, vol. 44 (7), pp. 24–29.

    CAS  Google Scholar 

  4. Advanced Materials and Processes, 1995, Oct., p. 8.

  5. D. Maass and M. Makwinski: 6th Int. SAMPE Electronicsference, Honolulu, HI. June 22–25, 1992.

  6. D.L. McDanels and J.O. Diaz: NASA TM-102328, 1989.

  7. S.M. DeVincent: NASA Contractor Report 187143, NASA, Washington, DC, 1991.

  8. D.L Ellis and D.L. McDanels: Metall. Trans. A, 1993, vol. 24A, pp. 43–52.

    CAS  Google Scholar 

  9. O.J. Ilegbusi: “Heat Transfer in Electronic System with Metal-Matrix Composite Heat Sink,” ASME-93-WA/EEP-28, ASME, Fairfield, NJ, 1993.

    Google Scholar 

  10. S.M. DeVincent, D.L. Ellis, and G.M. Michal: “Graphite/Copper Alloy Interfacial Energies Determined Using the Sessile Drop Method,” NASA Contractor Report 187087, NASA-Lewis Research Center, Cleveland, OH, 1991.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. the Chemical Engineering Department, Cleveland State University, 44115, Cleveland, OH

    S. K. Datta (Graduate Student), S. N. Tewari (Professor) & J. E. Gatica (Associate Professor)

  2. Super-Temp, BFGoodrich Aerospace, 90670, Santa Fe Springs, CA

    W. Shih (Product Manager)

  3. R&D, BFGoodrich Aerospace, 44141, Brecksville, OH

    L. Bentsen (Research Manager)

Authors
  1. S. K. Datta
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S. N. Tewari
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. J. E. Gatica
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. W. Shih
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. L. Bentsen
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Datta, S.K., Tewari, S.N., Gatica, J.E. et al. Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications. Metall Mater Trans A 30, 175–181 (1999). https://doi.org/10.1007/s11661-999-0205-7

Download citation

  • Received:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11661-999-0205-7

Keywords

Search

Navigation