Abstract
The plane-strain initiation fracture toughness (K JICi ) and plane-stress crack growth resistance of two Al-Cu-Mg-Ag alloy sheets are characterized as a function of temperature by a J-integral method. For AA2519 +Mg+Ag, K JICi decreases from 32.5 MPa√m at 25 °C to 28.5 MPa√m at 175 °C, while K JICi for a lower Cu variant increases from 34.2 MPa√m at 25 °C to 36.0 MPa√m at 150 °C. Crack-tip damage in AA2519+Mg+Ag evolves by nucleation and growth of voids from large undissolved Al2Cu particles, but fracture resistance is controlled by void sheeting coalescence associated with dispersoids. Quantitative fractography, three-dimensional (3-D) reconstruction of fracture surfaces, and metallographic crack profiles indicate that void sheeting is retarded as temperature increases from 25 °C to 150°C, consistent with a rising fracture resistance. Primary microvoids nucleate from smaller constituent particles in the low Cu alloy, and fracture strain increases. A strain-controlled micromechanical model accurately predicts K JICi as a function of temperature, but includes a critical distance parameter (l*) that is not definable a priori. Nearly constant initiation toughness for AA2519+Mg+Ag is due to rising fracture strain with temperature, which balances the effects of decreasing flow strength, work hardening, and elastic modulus on the crack-tip strain distribution. Ambient temperature toughnesses of the low Cu variant are comparable to those of AA2519+Mg+Ag, despite increased fracture strain, because of reduced constituent spacing and l*.
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Haynes, M.J., Gangloff, R.P. Elevated temperature fracture toughness of Al-Cu-Mg-Ag sheet: Characterization and modeling. Metall Mater Trans A 28, 1815–1829 (1997). https://doi.org/10.1007/s11661-997-0112-8
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DOI: https://doi.org/10.1007/s11661-997-0112-8