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Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

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Abstract

Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.

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This work was financially supported by the National Key R&D Program of China [Project No. 2017YFA0204403], the Shenzhen Virtual University Park [R-IND1710], and the Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center. Part of the work described in this paper was supported by the Research Grants Council of the Hong Kong Special Administrative Region, China [No. CityU 11209914], General Research Fund of Hong Kong [No. CityU 11247516], and Shenzhen Science and Technology Innovation Committee [Grants JCYJ20160401100358589]. This work was also supported by Province-Institute/Province-College Cooperation Project under Grant No. 2017IB016. The authors thank ShenZhen Cnuti Precious Metal Materials Co. Ltd. for providing experimental materials, and Dr. H.D. Bian for annealing treatment.

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The authors do not have any possible conflicts of interest.

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Authors and Affiliations

  1. Hong Kong Branch of National Precious Metals Material Engineering Research Center, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong, China

    HaoKun Yang, Jian Lu & Yang Lu

  2. Department of Mechanical Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong, China

    HaoKun Yang, Ke Cao, Jian Lu & Yang Lu

  3. Center for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, 8 Yuexing 1st Road, Shenzhen, China

    Jian Lu & Yang Lu

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  1. HaoKun Yang
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  2. Ke Cao
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Correspondence to Jian Lu or Yang Lu.

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Manuscript submitted December 6, 2018.

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Yang, H., Cao, K., Lu, J. et al. Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires. Metall Mater Trans A 50, 3013–3018 (2019). https://doi.org/10.1007/s11661-019-05209-w

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  • DOI: https://doi.org/10.1007/s11661-019-05209-w

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