Abstract
The research focuses on the interfacial design characteristics of Cu/SiCp composites by the provision of a metallic (NiP2) and a ceramic oxide (Y2O3) coating on SiCp for achieving better barrier or wetting properties. The research work further aims at the optimization of the powder metallurgy (PM) process parameters for compaction of interface-tailored Cu/SiCp composites. The microstructural and thermal property evaluation of the developed Cu/SiCp composite systems is described. The research evidences the best achievable thermal properties of developed Cu/SiCp composites and emphasizes the possible feasibility of establishing a materials development strategy toward their successful implementation as a novel thermal management material for aerospace electronic packages.
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G. Sundberg, P. Paul, C. Sung, and T. Vasilos: J. Mater. Sci., 2006, vol. 41, pp. 485–504.
M.Z. Bukhari, M.S.J. Hashmi, and D. Brabazon: Proceedings of the 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business, pp. 417–30.
J. Culham, A. Khan, M. Yovanovich, and S. Muzychka: J. Electron. Packag. 2007, 129, 76–81.
S.T. Sheppard, W.L. Pribble, D.T. Enerson, Z. Ring, R.P. Smith, S.T. Allen, and J.W. Palmour: 58th DRC Device Research Conference, Conference Digest 00TH8526, 2000.
M. Micovic, A. Kurdoghlian, P. Janke, P. Hashimoto, D.W.S. Wong, J.S. Moon, L. McCray, C. Nguyen: IEEE Trans. Electron. Dev, 2001, 48, 591–96.
J.W. Palmour, S.T. Sheppard, R.P. Smith, S.T. Allen, W.L. Pribble, T.J. Smith, Z. Ring, J.J. Sumarekis, A.W. Saxler, and J.W. Milligan: Int. Electron. Dev. Meet. Tech. Dig., 2001, pp. 17.4.1–17.4.4.
J. Barcena, J. Maudes, J. Coleto and I. Obieta: 5th ESA Round Table on Micro/Nano Technologies for Space, 2005.
C. Zweben: Power Electron. Technol., 2006, vol. 32, pp. 40–47.
M. Sherif El-Eskandarany: Mechanical Alloying for Fabrication of Advanced Engineering Materials, 1st ed., William Andrew Applied Science Publisher, New York, NY, 2001, pp. 231–42.
M.Z. Bukhari, D. Brabazon, and M.S.J. Hashmi: 28th Int. Manufacturing Conf., 2011.
Y. Goldberg, M.E. Levinshtein, and S.L. Rumyantsev: Properties of Advanced Semiconductor Materials GaN, AlN, SiC, BN, SiC, and SiGe, John Wiley & Sons, New York, NY, 2001, pp. 93–148.
T. Schubert, A. Brendel, K. Schmid, T. Koeck, L. Ciupiński, W. Zieliński, T. Weibgarber, and B. Kieback: Compos. Part A: Appl. Sci. Manuf., 2007, vol. 38, pp. 2398–2403.
K. Azmi, M.N. Derman, A.M. Mustafa Al Bakri, and A.V. Sandu: Key Eng. Mater., 2014, 594, 852–56.
M. Zaman, S.N.S. Bukhari, M.I.D. Brabazon, and M.S.J. Hashmi: 2nd Int. Malaysia-Ireland Joint Symp. on Engineering, Science and Business, 2012.
R. Warren and C.H. Anderson: Composites, 1984, vol. 15, pp. 101–111.
J. Boselli, P.D. Pitcher, P.J. Gregson, and I. Sinclair: Mater. Sci. Eng. A, Struct. Mater. Prop. Microstruct. Process., 2001, vol. 300, pp. 113–24.
K.M. Shu and G.C. Tu: Mater. Sci. Eng. A, Struct. Mater. Prop. Microstruct. Process., 2003, vol. 349, pp. 236–47.
G.E. Monastyrsky, V. Odnosum, and J. Van Humbeeck: Intermetallics, 2002, vol. 10, pp. 95–103.
T.S. Srivatsan, I.A. Ibrahim, F.A. Mohammed, and E.J. Lavernia: J. Mater. Sci., 1998, vol. 26, pp. 5965–78.
W.C. Harrigan, Jr.: Mater. Sci. Eng. A, 1998, vol. 24, pp. 75–82.
Q. Sun and O.T. Inal: Mater. Sci. Eng. B, 1996, vol. 41, pp. 261–66.
H. Schmidt-Brücken and W. Schlapp: Z. Angew. Phys., 1971, vol. 32, pp. 307–10.
B. Dewar, M. Nicholas, and P.M. Scott: J. Mater. Sci., 1976, vol. 11, pp. 1083–90.
G. Sundberg, P. Paul, C. Sung, and T. Vasilos: J. Mater. Sci., 2005, vol. 40, pp. 3383–93.
T. Weibgarber, G. Lefranc, J. Schulz-Harder, H. Meyer, and O. Stocker: Proc. Int. Conf. on Advances in Powder Metallurgy & Particulate Materials, PM2TEC2003 Part 6, Metal Powder Industries Federation, 2003.
T. Schubert, B. Trindade, T. Weibgarber, and B. Kieback: Mater. Sci. Eng. A, 2008, vol. 475, pp. 39–44.
A.E. Martinelli and R.A.L. Drew: Mater. Sci. Eng. A, 1995, vol. 191, pp. 239–47.
Kattamuri Nirupama: Characterization of Various Metal Matrix Composite Thermal Management Materials, University of Massachusetts, Lowell, MA, 2009.
M.Z. Bukhari, M.S.J. Hashmi, and D. Brabazon: Aus. J. Basic Appl. Sci., 2013, vol. 7, pp. 350–65.
S. Kavithaa, B.C. Pai, R.M. Pillai, K.G. Satyanarayana, and S. Banerjee: An Improved Sol–Gel Process for Coating Ceramic Reinforcements with Rare Earth Oxides, PAN0370/DEL/2008.
G. Celebi Efe, I. Altinsoy, M. Ipek, S. Zeytin, and C. Bindal: Acta Physica Polonica A, 2012, 121, 251–53.
G. Celebi Efe, I. Altinsoy, T. Yener, M. Ipek, S. Zeytin, and C. Bindal: Acta Physica Polonica A, 2014, 125, 417–19.
R. Sheshadri, V. Narayanaswamy, B. Dwarakanatha Rao, and L. Rangaraj: Advances in High-Pressure Science and Technology, Tata McGraw-Hill, New Delhi, 1995.
Acknowledgments
One of the authors (TSK) appreciates the financial assistance received under the Sensor Technology Development Facility from the Department of Heavy Industries and Public Enterprises, Government of India, to carry out this research work. The authors thank the directors, CMTI and CSIR-NAL, for the infrastructural support extended. TSK acknowledges her seniors Smt. S. Usha, Shri. S. Arumugasamy, and Dr. C.K. Srinivasa, CMTI, for the encouragement and support received. TSK thanks Shri. P. Aravindram, ISRO Satellite Application Centre, Bangalore, and Shri. A. Peer Mohamed, NIIST, Trivandrum, for extending the thermal characterization facilities; she also thanks M/s Carborundum Universal Limited, Chennai, for arranging the supply of green SiCp used in the research study.
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Manuscript submitted June 14, 2018.
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Kavithaa, T.S., Rangaraj, L. & Avadhani, S.S. Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route. Metall Mater Trans A 50, 1902–1913 (2019). https://doi.org/10.1007/s11661-018-5089-y
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DOI: https://doi.org/10.1007/s11661-018-5089-y