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Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route

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Abstract

The research focuses on the interfacial design characteristics of Cu/SiCp composites by the provision of a metallic (NiP2) and a ceramic oxide (Y2O3) coating on SiCp for achieving better barrier or wetting properties. The research work further aims at the optimization of the powder metallurgy (PM) process parameters for compaction of interface-tailored Cu/SiCp composites. The microstructural and thermal property evaluation of the developed Cu/SiCp composite systems is described. The research evidences the best achievable thermal properties of developed Cu/SiCp composites and emphasizes the possible feasibility of establishing a materials development strategy toward their successful implementation as a novel thermal management material for aerospace electronic packages.

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Acknowledgments

One of the authors (TSK) appreciates the financial assistance received under the Sensor Technology Development Facility from the Department of Heavy Industries and Public Enterprises, Government of India, to carry out this research work. The authors thank the directors, CMTI and CSIR-NAL, for the infrastructural support extended. TSK acknowledges her seniors Smt. S. Usha, Shri. S. Arumugasamy, and Dr. C.K. Srinivasa, CMTI, for the encouragement and support received. TSK thanks Shri. P. Aravindram, ISRO Satellite Application Centre, Bangalore, and Shri. A. Peer Mohamed, NIIST, Trivandrum, for extending the thermal characterization facilities; she also thanks M/s Carborundum Universal Limited, Chennai, for arranging the supply of green SiCp used in the research study.

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Correspondence to T. S. Kavithaa.

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Manuscript submitted June 14, 2018.

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Kavithaa, T.S., Rangaraj, L. & Avadhani, S.S. Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route. Metall Mater Trans A 50, 1902–1913 (2019). https://doi.org/10.1007/s11661-018-5089-y

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