Abstract
Copper alloys exhibit a positive thermal expansion effect, which is undesirable to materials as in service, while TiNi composite materials exhibit negative thermal expansion. In this study, we fabricated a new high-density Cu/TiNi composite with low thermal expansion through electroless deposition and powder metallurgy. Mixed powders of 15% electroless deposited Cu-TiNi composite powders, and 85% prepared Cu powders were cold extruded, vacuum hot press heat-treated, and hot compressed at 900°C for 2 h. The coefficients of thermal expansion of the Cu/TiNi composite at 100°C, 200°C, and 300°C were 13.99 × 10−6/K, 17.28 × 10−6/K, and 17.72 × 10−6/K, respectively. The fabricated Cu/TiNi composite materials showed good air-tightness and negative thermal expansion, so have bright prospects in lead frames and other electrical and electronic applications.
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Acknowledgements
This work was supported by the National MCF Energy R&D Program of China (2018YFE0306100), the National Natural Science Foundation of China (51901250), and the National Natural Science Foundation of Hunan Province (2019JJ50765).
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Xiao, T., Li, Z., Xiao, Z. et al. Fabrication of a Cu/TiNi Composite with High Air-Tightness and Low Thermal Expansion. JOM 72, 883–888 (2020). https://doi.org/10.1007/s11837-019-03930-w
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DOI: https://doi.org/10.1007/s11837-019-03930-w